All books are available through online web bookstores including Amazon.com.  For all other Publications and Papers please CONTACT US.


E. Suhir, “Human-in-the-Loop: Probabilistic Modeling of an Aerospace Mission/Situation Outcome”, signed agreement with CRC Press, Sept. 8, 2017
E. Suhir, “Mechanical Behavior of Electronic Materials and Systems”, signed agreement with Springer, Sept. 8, 2017
E. Suhir, D. Steinberg, T. Yi, eds., “Dynamic Response of Electronic and Photonic Systems to Shocks and Vibrations”, John Wiley, 2011
X. Fan, E. Suhir, “Moisture Sensitive Plastic Packages of IC Devices”, Springer, 2010
E. Suhir, CP Wong, YC Lee, eds. “Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability”, 2 volumes, Springer, 2008
R. G. Driessen, J. G. Baets, J. G. McInerney, and E. Suhir, eds.“Laser Diodes, Optoelectronic Devices, and Heterogeneous Integration”, (SPIE),  2003
E. Suhir, M. Fukuda, C. R. Kurkjian, eds., “Reliability of Photonic Materials and Structures”, Materials Research Society Symposia Proceedings, vol. 531, 1998.
E. Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, ASME Press, 1997
E. Suhir, “Applied Probability for Engineers and Scientists”, McGraw Hill, New York, 1997.
E. Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, ASME Press, 1996
E. Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, ASME Press, 1995
M. Schen, H. Abe, and E. Suhir, eds. “Thermal and Mechanical Behavior and Modeling”, ASME, AMD-Vol,1994
E. Suhir, “Structural Analysis in Microelectronic and Fiber Optic Systems”, vol.1, Basic Principles of Engineering Elasticity and Fundamentals of Structural Analysis”, Van Nostrand Reinhold, New York, 1991.
E. Suhir, R.C. Cammarata, D.D.L. Chung, M.Jono, eds. “Mechanical Behavior of Materials and Structures in    Microelectronics”, Materials Research Society Symposia Proceedings, vol.226, 1991.
E. Suhir,P. McSharry, “Soviet Naval Architecture: Theory and Applications of Hydrodynamics (Trans from Russian)”, 1986
E. Suhir, Y. Raskin, A. Tunik, “Russian Strength Standards for Commercial Ships”, American Bureau of Shipping, 1982


Book chapters

E. Suhir, “Mental Workload (MWL) vs. Human Capacity Factor (HCF): a Way to Quantify Human Performance”, in preparation
E. Suhir, "What Could Possibly Be Done to Relieve Stress in the Second Level of Interconnection" (in preparation)
E. Suhir, “Predicted Thermal and Lattice-Mismatch Stresses”, in T. Nishinaga and T.F.Kuech, eds., “Handbook of Crystal Growth”, 2e, vol.3, , Elsevier, 2015 
E. Suhir, "Analysis of a Pre-Stressed Bi-Material Accelerated Life Test (ALT) Specimen", Encyclopedia of Thermal Stresses, R. Hetnarski, ed., Springer, 2013
E. Suhir, "Thermal Stress in a Multi-Leg Thermoelectric Module (TEM) Design", Ibid.
E. Suhir, "Thermal Stress in a Tri-Materilal Assembly with Application to Silicon-Based Photovoltaic Module (PVM)", Ibid.
E. Suhir, "Thermoelastic Stability of an Embedded Nano-Fiber", Ibid.
E. Suhir, “Linear Response to Shocks and Vibrations”, in E. Suhir, D. Steinberg and T. Yu, “Structural Dynamics of Electronic and Photonic Systems”, John Wiley, Hoboken, NJ., 2011
E. Suhir, “Linear and Nonlinear Vibrations Caused by Periodic Impulses”. Ibid
E. Suhir, “Random Vibrations of Structural Elements in Electronic and Photonic Systems”, Ibid
C.Y.Zhou, T.X.Yu, S.W.Ricky Lee and E.Suhir, “Shock Test Methods and Test Standards for Portable Electronic Devices”, Ibid
E. Suhir, “Shock Protection of Portable Electronic Devices Using a “Cushion” of an Array of Wires (AOW)”, Ibid
M. Vujosevic and E.Suhir, “Dynamic Response of PCB Structures to Shock Loading in Reliability Tests”, Ibid
E. Suhir, “Linear Response of a Single-Degree-of-Freedom System to an Impact Load: Could Shock Tests Adequately Mimic Drop Test Conditions?”, Ibid
E. Suhir and L. Arruda, “Could an Impact Load of Finite Duration Be Substituted with an Instantaneous Impulse”? Ibid
E. Suhir, “”Stretchable” Electronics: Predicted Thermo-Mechanical Stresses in the Die”,  Fraunhofer  Institute, Volume Dedicated to the 60-th Birthday of Prof. B. Michel, Berlin, Germany, 2009
Y. Zhang, E. Suhir, C. Gu, “Physical Properties and Mechanical Behavior of  Carbon Nano-tubes (CNTs) and Carbon Nano-fibers  (CNFs) as Thermal Interface Materials (TIMs) for High Power Integrated Circuit (IC) Packages: Review and Extension, in C.P.Wong et al, eds, “Nano-Bio-Electronic, Photonic and MEMS Packaging”, Springer, 2009
E. Suhir, “Fiber-Optics Structural Mechanics and Nano-Technology Based New Generation of Fiber Coatings: Review and Extension”, in E. Suhir, CP Wong, YC Lee, eds. “Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability”, 2 volumes, Springer, 2008
E. Suhir, “Dynamic Response of Micro-Electronic Systems to Shocks and Vibrations: Review and Extension”, Ibid
V. Birman and E. Suhir, “Effect of Material’s Nonlinearity on the Mechanical Response of Some Piezo-Electric and Photonic Systems”, Ibid
E. Suhir, “Analytical Thermal Stress Modeling in Physical Design for Reliability of Micro- and Opto-Electronic Systems: Role, Attributes, Challenges, Results”, Ibid
E. Suhir, “How to Make a Device into a Product: Accelerated Life Testing It’s Role, Attributes, Challenges, Pirfalls, and Interaction with Qualification Testing”, Ibid
E. Suhir, D. Ingman, “Highly Compliant Bonding Material and Structure for Micro- and Opto-Electronic Applications”, Ibid
E. Suhir, “Effect of Plastic Package Geometry on its Propensity to Moisture Induced Failure”, in R. Tummala, M. Kosec, W. Kinzy Jones and D. Belavic, eds., “Electronic Packaging for High Reliability: Low Cost Electronics”, NATO ASI Series, 3. “High Technology”, vol.57, Kluwer Academic Publishers, 1999.
E. Suhir, “Structural Analysis in Fiber Optics”, in J. Menon, ed., “Trends in Lightwave Technology”, Council of Scientific Information, India, 1995.
E. Suhir, “Predicted Bow of Plastic Packages of Integrated Circuit Devices”, in J. H. Lau, ed., Thermal Stress and Strain in Microelectronic Packaging”, Van Nostrand Reinhold, New York, 1993.
E. Suhir and Y.C. Lee, “Thermal, Mechanical and Environmental Durability Design Methodologies in Electronic Packaging”, in “Handbook of Electronic Materials”, ASM International, 1990.
E. Suhir, “Thermal Stress Failures in Microelectronic Components - Review and Extension”, in A. Bar-Cohen and A. D. Kraus, eds., “Advances in Thermal Modeling of Electronic Components and Systems”, Hemisphere, New York, 1988.

Archival (peer reviewed) journal papers

2017


E.Suhir, “Statistical Failure Rate of an Electronic Product Comprised of Mass-Produced Components”, Int. J. of Reliability and Safety, submitted
E.Suhir, “A Way to Quantify the Roles of the Two Major Aspects of the Human Factor: Human Error and His/Her State-of-Health”,   Int. J. of Human Factor Modeling and Simulation, submitted 
E.Suhir, “What Could and Should Be Done Differently: Failure-Oriented-Accelerated-Testing (FOAT) and Its Role in Making an Aerospace Electronics Device into a Product”, Journal of Materials Science: Materials in Electronics, submitted
E.Suhir, “Aerospace Electronics Reliability Prediction: Application of Two Advanced Probabilistic Techniques”, ZAMM, submitted
E.Suhir, “Analytical Thermal Stress Model for a Typical Flip-Chip Package Design”, Journal of Materials Science: Materials in Electronics, submitted
E. Suhir, “Flip-Chip Assembly: Is a Bi-Material Model Acceptable?”, Journal of Materials Science: Materials in Electronics, Vol. 28, No. 21, 2017.
E.Suhir, “Analytical Modeling Enables Explanation of Paradoxical Behaviors of Electronic and Optical Materials and Assemblies”, Advances in Materials Research, vol.6, No.2, 2017
E. Suhir, “Human-in-the-Loop: Application of the Double Exponential Probability Distribution Function Enables One to Quantify the Role of the Human Factor”, Int. J. of Human Factor Modeling and Simulation, v.5, No.4, 2017
E. Suhir and R. Ghaffarian, “Predictive Modeling of the Dynamic Response of Electronic Systems to Impact Loading: Review”, ZAMM, 97, No. 6, 699–717, 2017
E. Suhir, and S. Yi, “Probabilistic Design for Reliability (PDfR) of Medical Electronic Devices (MEDs): When Reliability is Imperative, Ability to Quantify it is a Must”, Journal of SMT, v. 30, Issue 1, 2017
E. Suhir, S. Yi and R. Ghaffarian, “How Many Peripheral Solder Joints in a Surface Mounted Design Experience Inelastic Strains?”, Journal of Electronic Materials, v.46, No.3, 2017
E. Suhir, “Static Fatigue Lifetime of Optical Fibers Assessed Using Boltzmann-Arrhenius-Zhurkov (BAZ) Model”, Journal of Materials Science: Materials in Electronics, v.28, No.16, 2017
E. Suhir, R.Ghaffarian, S.Yi, and J.Nicolics “Assessed Interfacial Strength and Elastic Moduli of the Bonding Material from  Shear-off Test Data”, Journal of Materials Science: Materials in Electronics, v.28, No.9, 2017
E. Suhir and R. Ghaffarian, “Solder Material Experiencing Low Temperature Inelastic Thermal Stress and Random Vibration Loading: Predicted Remaining Useful Lifetime”, Journal of Materials Science: Materials in Electronics, vol.28, No.4, 2017
E. Suhir and R. Ghaffarian, “Probabilistic Palmgren-Miner Rule with Application to Solder Materials Experiencing Elastic Deformations”, Journal of Materials Science: Materials in Electronics, vol.28, No.3, 2017
E. Suhir, R. Ghaffarian, and S. Yi, “Reliability Physics Behind the QFN State of Stress”, Journal of Materials Science: Materials in Electronics, v.28, No.2, 2017

2016


E. Suhir, R. Ghaffarian, “Column-Grid-Array (CGA) vs. Ball-Grid-Array (BGA): Board-Level Drop Test and the Expected Dynamic Stress in the Solder Material”, Journal of Materials Science: Materials in Electronics, vol.27, No.11, 2016
E. Suhir, S. Yi, G. Khatibi, J. Nicolics, M. Lederer, “Semiconductor Film Grown on a Circular Substrate: Predictive Modeling of Lattice-Misfit Stresses”, Journal of Materials Science: Materials in Electronics, vol.27, No.9, 2016
E. Suhir, R. Ghaffarian, “Board Level Drop Test: Exact Solution to the Problem of the Nonlinear Dynamic Response of a PCB to the Drop Impact”,   Journal of Materials Science: Materials in Electronics, vol.27, No.9, 2016
E.  Suhir, “Analytical Modeling Occupies a Special Place in the Modeling Effort”, Short Comm., J.Phys.Math., 7(1), 2016
E. Suhir, J. Morris, L. Wang, and S. Yi, “Could the Dynamic Strength of a Bonding Material in an Electronic Device Be Assessed from Static Shear-Off Test Data?”, Journal of Materials Science: Materials in Electronics, vol.27, No.7, 2016
E. Suhir, and J.Nicolics, “Power Core (PC) Embedding a Plurality of IC Devices and Sandwiched Between Two Dissimilar Insulated Metal Substrates (IMS’): Predicted Thermal Stresses”, Journal of Materials Science: Materials in Electronics, vol.27, No.7, 2016
E. Suhir, “Bi-Material Assembly Subjected to Thermal Stress: Propensity to Delamination Assessed Using Interfacial Compliance Model”,  Journal of Materials Science: Materials in Electronics, vol.27, No.7, 2016
E. Suhir, “Expected Stress Relief in a Bi-Material Inhomogeneously Bonded Assembly with a Low-Modulus-and/or-Low-Fabrication-Temperature Bonding Material at the Ends”, Journal of Materials Science: Materials in Electronics, vol.27, No.6, 2016
E. Suhir, R. Ghaffarian, "Predicted Stresses in a Ball-Grid-Array (BGA)/Column-Grid-Array (CGA) Assembly with Epoxy Adhesive at Its Ends", Journal of Materials Science: Materials in Electronics, vol.27, No.5, 2016
E. Suhir, “Bi-Material Assembly with a Low-Modulus-and/or-Low-Fabrication-Temperature Bonding Material at Its Ends: Optimized Stress Relief”, Journal of Materials Science: Materials in Electronics, vol.27, No.5, 2016
E. Suhir, R. Ghaffarian, J. Nicolics,, “Predicted Stresses in Ball-Grid-Array (BGA) and Column-Grid-Array (CGA)  Interconnections in a Mirror-like Package Design”, Journal of Materials Science: Materials in Electronics, vol.27, No.3, 2016
E. Suhir, R. Ghaffarian, J. Nicolics,  “Could Thermal Stresses in an Inhomogeneous BGA/CGA System be Predicted Using a Model for a Homogeneously Bonded Assembly?”, Journal of Materials Science: Materials in Electronics, vol.27, No. 1, 2016

2015

E. Suhir,  "Predicted Stresses in a Ball-Grid-Array (BGA)/Column-Grid-Array (CGA) Assembly with a Low Modulus Solder at Its Ends", Journal of Materials Science: Materials in Electronics, vol.26, No.12, 2015
E. Suhir, “Analytical Modeling Enables One to Explain Paradoxical Situations in the Behavior and Performance of Electronic Materials and Products: Review”,  Journal of Physical Mathematics 07(01) · Dec. 2015
E. Suhir, “Analysis of a Short Beam with Application to Solder Joints: Could Larger Stand-off Heights Relieve Stress?”, European Journal of Applied Physics (EPJAP), vol. 71, 2015
A. Bensoussan, E. Suhir, P. Henderson, M. Zahir, “A Unified Multiple Stress Reliability Model for Microelectronic Devices — Application to 1.55 μm DFB Laser Diode Module for Space Validation”,  Microelectronics Reliability, June 2015
E. Suhir, R. Ghaffarian, J. Nicolics, “Could Application of Column-Grid-Array Technology Result in Inelastic-Strain-Free State-of-Stress in Solder Material?”, Journal of Materials Science: Materials in Electronics, vol.26, No.12, 2015
E. Suhir, "Analytical Bathtub Curve with Application to Electron Device Reliability", Journal of Materials Science: Materials in Electronics, vol. 26, Issue 9, 2015.

2014

E. Suhir, “Human-in-the-loop (HITL): Probabilistic Predictive Modeling (PPM)  of an Aerospace Mission/Situation Outcome”, Aerospace, No.1, 2014
E. Suhir and A. Bensoussan, "Quantified Reliability of Aerospace Optoelectronics," SAE Int. J. Aerosp. 7(1), 2014
E. Suhir and J. Nicolics, “Analysis of a Bow-Free Pre-Stressed Test Specimen”, ASME JAM, vol.81, No.11, 2014
E. Suhir, “Three-Step Concept in Modeling Reliability: Boltzmann-Arrhenius-Zhurkov Physics-of-Failure-Based Equation Sandwiched Between Two Statistical Models”, Microelectronics Reliability, Oct. 2014
E. Suhir, “Compressed Cantilever Beam on an Elastic Foundation, with Application to a Dual-Coated Fiber-Optic Connector”, Int. Journal of Engineering Sciences, published on line, July 2014
E. Suhir, “Human-in-the-loop: Probabilistic Predictive Modeling, Its Role, Attributes, Challenges and Applications”, Theoretical Issues in Ergonomics Science (TIES), published on line, July 2014
E. Suhir, C. Bey, S. Lini, J.-M. Salotti, S. Hourlier, B. Claverie, “Anticipation in Aeronautics: Probabilistic Assessments”, Theoretical Issues in Ergonomics Science, published on line, June 2014
A. Ziabari, E.Suhir, A. Shakouri, “Minimizing Thermally Induced Interfacial Shearing Stress in a Thermoelastic Module with Low Fractural Area Coverage”, Microelectronics Reliability, Vol. 45, Issue 5, May 2014
E. Suihir, “Fiber Optics Engineering: Physical Design for Reliability”, Facta Universitatis: series Electronics and Energetics", Vol. 27, No 2, June 2014
E. Suhir, “Thermal Stress in Through-Silicon-Vias: Theory-of-Elasticity Approach”, Microelectronics Reliability, vol.54, 2014
E. Suhir, “Statistics- and Reliability-Physics-Related Failure Processes”, Modern Physics Letters B (MPLB), Vol. 28, No. 13, 2014
J.-M. Salotti and E. Suhir, “Manned Missions to Mars: Minimizing Risks of Failure”, Acta Astronautica,   Vol. 93, January 2014

2013

E. Suhir, S. Kang, J. Nicolics, C. Gu, A. Bensoussan, L. Bechou, “Predicted Thermal Stresses in a Cylindrical Tri-Material Body, with Application to Optical Fibers Embedded into Silicon",  J. of Electrical and Control Engineering, Vol.3 No.6, December 2013
E. Suhir, “Lattice-Misfit Stresses in a Circular Bi-Material Gallium-Nitride Assembly”, ASME J. Appl. Mech., vol.80, January 2013
E. Suhir, “How Long Could/Should be the Repair Time for High Availability?”, Modern Physics Letters B (MPLB), vol.27, Aug.30, 2013
E. Suhir, “Could Electronics Reliability Be Predicted, Quantified and Assured?” Microelectronics Reliab., No. 53, April 15, 2013
E. Suhir, S. Kang, “Boltzmann-Arrhenius-Zhurkov (BAZ) Model in Physics-of-Materials Problems”, Modern Physics Letters B (MPLB), vol.27, April 2013
E. Suhir, “Structural Dynamics of Electronics Systems”, Modern Physics Letters B (MPLB), Vol. 27, No. 7, March 2013
E. Suhir, “Thermal Stress Failures in Electronics and Photonics: Physics, Modeling. Prevention”, J. Thermal Stresses, June 3, 2013
E. Suhir, ”“Miracle-on-the-Hudson”: Quantified Aftermath”, Int. J. Human Factors Modeling and Simulation, April 2013
E. Suhir and  A.Shakouri, “Predicted Thermal Stresses in a Multi-Leg Thermoelectric Module (TEM) Design”, ASME J. Appl. Mech., vol. 80,


March 2013


E. Suhir,  D. Shangguan, L. Bechou, “Predicted Thermal Stresses in a Tri-Material Assembly with Application to Silicon-Based Photovoltaic Module ”, ASME J. Appl. Mech., vol.80, March 2013
E. Suhir, L.Bechou, B. Levrier, “Predicted Size of an Inelastic Zone in a Ball-Grid-Array Assembly”, ASME J. Appl. Mech., vol. 80, March 2013

2012

W. Benhadjala, I. Bord-Majek, L. Bechou, E. Suhir, M.Buet, F. Rougé, V. Gaud, B. Plano, Y. Ousten, "Improved Performances of Polymer-Based Dielectric by Using Inorganic/Organic  Core-Shell Nanoparticles", Appl. Phys. Lett., 101, 142901, Oct. 2012
E. Suhir, A. Shakouri, “Assembly Bonded at the Ends:  Could Thinner and Longer Legs Result in a Lower Thermal Stress in a Thermoelectric Module (TEM) Design?”, ASME J. Appl. Mech., vol.79, No.6, 2012
E. Suhir, “When Reliability is Imperative, Ability to Quantify It is a Must”, IMAPS Advanced Microelectronics, August 2012
E. Suhir, D. Shangguan, L .Bechou, “Predicted Thermal Stresses in a Photovoltaic  Module (PVM)”, PV International (UK),  Second Quarter, May 2012
E. Suhir, J. Nicolics, “Bending of a Bi-Material Cantilever Beam, with Consideration of the Role of the Interfacial Shearing Stress”, ZAMM, vol.92, No.7, 2012
E. Suhir, “Likelihood of Vehicular Mission-Success-and-Safety”, J. of Aircraft, vol.49, No.1, 2012

2011

E. Suhir, “Remaining Useful Lifetime (RUL): Probabilistic Predictive Model”, Int. J. of PHM, vol 2(2), 2011
E. Suhir, W.Gschohsmann, J. Nicolics, “Analysis of a Bi-Material Strip”, Z. Angew. Math. Mech., 1 - 9 2011
E. Suhir, “Stresses in Bi-Material GaN Assemblies”, J. Appl. Physics, 110, published on line, 2011
E. Suhir, “Predicted Response of the Die-Carrier Assembly to the Combined Action of Tension and Bending Applied to the Carrier in Flexible Electronics”, ASME J. Appl. Mech., vol. 79, No.1, 2011
E. Suhir, C.Gu, L.Cao, “Predicted Thermal Stress in a Circular Adhesively Bonded Assembly with Identical Adherends”, ASME J. Appl. Mech, vol. 79, No.1, 2011
E. Suhir, “Elastic Stability of a Rod Supported by an Elastic Foundation, with Application to Nano-Composites”, ASME J. Appl. Mech, vol. 79, No.1, 2011
W. Gschohsmann, J. Nicolics, E. Suhir, “Deformations in Stretched Surface Mounted Ceramic Strips for Sensor Applications”, Microelectronics International, vol.28, Issue 3, 2011
E. Suhir, “Thermal Stress Failures: Predictive Modeling Explains the Reliability Physics Behind Them”, IMAPS Advanced Microelectronics, vol.38, No.4, July/August 2011
E. Suhir, “Predictive Modeling of the Dynamic Response of Electronic Systems to Shocks and Vibrations”, ASME Appl. Mech. Reviews, vol. 63, No.5, March, 2011
E. Suhir, “Analysis of a Pre-Stressed Bi-Material Accelerated Life Test (ALT) Specimen”, Zeitschrift fur Angewandte Mathematik und Mechanik (ZAMM), vol.91, No.5, 2011
E. Suhir and R. H. Mogford, “"Two Men in a Cockpit": Probabilistic Assessment of the Likelihood of a Casualty if One of the Two Navigators Becomes Incapacitated”, J. of Aircraft, vol.48, No.4, July-August 2011

2010

W. Gschohsmann, J. Nicolics,  E. Suhir, “Elastizitätsmodell eines keramischen Sensorstreifens bei longitudinaler Verformung”,  Elektrotechnik und Informationstechnik, Vol. 127, No.10, October 2010
E. Suhir, “Probabilistic Modeling of the Role of the Human Factor in the Helicopter-Landing-Ship (HLS) Situation”, Int. J. Human Factor Modeling and Simulation (IJHFMS), vol.1, Issue 3, 2010
E. Suhir, W. Gschohsmann, J. Nicolics, “Analysis of an Elongated Stretched Strip, With Application to a Strain-Gage Electrical Sensor Structure’, ZAMM, No.10, 2010
E.Suhir, “Predicted Stresses in Die-Carrier Assemblies in “Stretchable” Electronics: Is There an Incentive for Using a Compliant Bond?”,  ZAMM, No.10, 2010
E. Suhir and L.Arruda, “Could an Impact Load of Finite Duration Acting on a Duffing Oscillator Be Substituted with an Instantaneous Impulse?”, JSME J. Solid Mech. and Materials Engineering (JSMME), vol.4, No.9, 2010
E. Suhir and T. Reinikainen, “Interfacial Stresses in a Lap Shear Joint (LSJ): The “Transverse Groove Effect” (TGE)”, JSME J. Solid Mech. and Materials Engineering (JSMME), vol.4, No.8, 2010 
E. Suhir and M.Vujosevic, “Bi-Material Assembly Subjected to Tensile Forces and Bending Moments Applied to the Ends of One of Its Components”, JSME J. Solid Mech. and Materials Engineering (JSMME), vol.4, No.4, 2010
E. Suhir, “Optical Fiber Interconnects: Design for Reliability”, Society of Optical Engineers (SPIE), Proc. of SPIE, Vol. 7607 760717-8, 2010

2009

E. Suhir and L. Arruda, “The Coordinate Function in the Problem of the Nonlinear Dynamic Response of an Elongated Printed Circuit Board (PCB) to a Drop Impact Applied to Its Support Contour”, European J. Appl. Physics, vol.48, No.2, 2009
C.Y.Zhou, T.X.Yu, E.Suhir,  “Design of Shock Table Tests to Mimic Real-Life Drop Conditions”, IEEE CPMT Transactions, vol.32, No.4, 2009
Biswas, I.S. Bayer, A. Tripathi, E.H.Lock, S.G. Walton, M.G. Norton, D.K. Avasthi, D.H.Dahanayaka, L.A.Bumm, E.Suhir, A.R.   Chowdhury, R. Gupta, “Fabrication of Nanoelectric Composites Exhibiting Stable Capacitor Functions in the High Frequency (≥100MHz) Through Interfacial Polarization Interactions”, Nanoscience and Nanotechnology Letters, vol.1, 1-8, 2009
I.S. Biswas, D.H.Bayer, L.A. Dahanayaka, Z. Bumm, F, Li, R. Watanabe, Y. Sharma, A.S.. Xu, M.G. Norton, E. Suhir, “Tailored Polymer-Metal Fractal Nanocomposites: An Approach to highly Active SERS Substrates”, Nanotechnology, 20, 2009
E. Suhir, “On a Paradoxical Situation Related to Bonded Joints: Could Stiffer Mid-Portions of a Compliant Attachment Result in Lower Thermal Stress?”, JSME J. Solid Mech. and Materials Engineering (JSMME),   vol.3, No.7, 2009
E .Suhir, “Helicopter-Landing-Ship: Undercarriage Strength and the Role of the Human Factor”, ASME OMAE Journal, vol. 132, No.1,  Dec. 22,  


2009

E. Suhir, “Probabilistic Modeling of the Role of the Human Factor in the Helicopter Landing Ship (HLS) Situation”, International Journal of Human Factor Modeling and Simulation (IJHFMS),  2009
E. Suhir, “Analytical Thermal Stress Modeling in Electronic and Photonic Systems”, ASME App. Mech. Reviews, invited paper, vol.62, No.4, 2009.
E. Suhir and T. Reinikainen, “Interfacial  Stresess and a  Lap Shear Joint (LSJ): The “Transverse Groove Effect” (TGE)”, JSME J. Solid Mech. and Materials Engineering (JSMME),  vol.3, No.6, 2009
E. Suhir,  M. Vujosevic, and T. Reinikainen,  “Nonlinear Dynamic Response of a “Flexible-and-Heavy” Printed Circuit Board (PCB) to an Impact Load Applied to Its Support Contour”, J. Appl. Physics, D, 42, No.4, 2009
E. Suhir, “Thermal Stress in a Bi-Material Assembly with a “Piecewise-Continuous” Bonding Layer: Theorem of Three Axial Forces”, J. Appl. Physics, D, 42, 2009

2008

E. Suhir and M. Vujosevic, “Interfacial Stresses in a Bi-material Assembly with a Compliant Bonding Layer”, J. Appl. Physics D, vol.41, 2008
E. Suhir and T. Reinikainen, “On a Paradoxical Situation Related to Lap Shear Joints: Could Transverse Grooves in the Adherends Lead to Lower Interfacial Stresses?”, J.  Appl. Physics D, vol.41, 2008
E. Suhir, “Lateral Compliance of a Compressed Cantilever Beam, with Application to Micro-Electronic and Fiber-Optic Structures”, J. Appl. Physics D, vol.41,No.1,  2008
I.S.Bayer, A.Biswas, J.B.Szczech, E.Suhir, M.G.Norton, “Radio Frequency Functional Capacitors Made of All-Organic Composites of Thiourea in Field-Responsive Polymers for Embedded Applications”, Applied Physics Letters, vol. 92, No.1, 2008.

2007

T. Mirer, D. Ingman, E. Suhir, “Reliability Improvement Through Nano-Particle-Material-Based Fiber Structures”, Optical Fiber Technology, v. 13, 2007
E. Suhir, “Elastic Stability of a Dual-Coated Optical Fiber of Finite Length”, J. Appl. Physics, vol.102, No.5, 2007
E. Suhir, “Response of a Heavy Electronic Component to Harmonic Excitations Applied to Its External Electric Leads”, Elektrotechnik & Informationstechnik (Austria), vol.9, 2007
E. Suhir, “Elastic Stability of a Dual-Coated Optical Fiber with a Stripped Off Coating at Its End”, Journal of Applied Physics, vol. 102, No.4, 

2006

E.Suhir, “Interfacial Thermal Stresses in a Bi-Material Assembly with a Low-Yield-Stress Bonding Layer”, Modeling and Simulation in Materials Science and Engineering, vol. 14, 2006
Y. Xu, Y. Zhang, E. Suhir, and X. Wang, ” Thermal Properties of Carbon Nanotube Array for Integrated Circuits Cooling” J. Appl. Physics, 100, 074302, 2006
Y. Zhang, Y. Xu and E. Suhir,  “Effect of Rapid Thermal Annealing (RTA) on Thermal Properties of Carbon Nanofibre (CNF) Arrays”, J. Appl. Physics D: Applied Physics ,39, 2006
Y. Zhang, Y. Xu and E. Suhir,  “Effective Young’s Modulus of Carbon Nano-Fiber Array”,  J. Materials Research (JMR),vol.21, No.11, Nov. 2006
Y. Zhang, E. Suhir, Y. Xu, and C. Gu, “ Bonding Strength of Carbon Nanofiber Array to its Substrate”,  JMR, vol. 21, No.11, Nov.2006

2003

E. Suhir, “Thermal Stress in an Adhesively Bonded Joint with a Low Modulus Adhesive Layer at the Ends”,  J.  Appl. Phys., April 2003
E. Suhir, “Modeling of Thermal Stress in Microelectronic and Photonic Structures: Role, Attributes, Challenges and Brief Review”, Special Issue, ASME J. Electr. Packaging (JEP), vol.125, No.2, June 2003
E. Suhir, “Bow Free Adhesively Bonded Assemblies: Predicted Stresses”, Electrotechnik & Informationtechnik, 120 (6), June 2003

2002

E. Suhir, “Accelerated Life Testing (ALT) in Microelectronics and Photonics: Its Role, Attributes, Challenges, Pitfalls, and Interaction With Qualification Tests”, ASME J. Electr. Packaging (JEP), Vol. 124, No. 3, 2002
E.Suhir, “Could Shock Tests Adequately Mimic Drop Test Conditions?”, J. Electr. Packaging (JEP), July, 2002

2001

E. Suhir, “Thermal Stress in a Polymer Coated Optical Glass Fiber with a Low Modulus Coating at the Ends”, J.  Mat. Res., vol. 16,  No. 10,   2001
M. Ushitsky, E. Suhir, G.W. Kammlott, “Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach”, ASME J.  Electr. Pack., vol.123, No.4, 2001
E. Suhir, "Analysis of Interfacial Thermal Stresses in a Tri-Material Assembly", J. Appl. Physics, vol.89, No.7, 2001
E. Suhir, “Thermal Stress in a Bi-Material Assembly Adhesively Bonded at the Ends”, J. Appl. Physics, vol. 89, No.1, 2001.
M. Uschitsky and E. Suhir, “Moisture Diffusion in Epoxy Molding Compounds Filled with Particles", ASME J. Electr. Pack., vol.123, No.1, 2001

2000

E. Suhir, “Microelectronics and Photonics – the Future”, Microelectronics Journal, vol.31, No.11-12, 2000
E. Suhir, and J.J. Vuillamin, Jr, "Effects of the CTE and Young's Modulus Lateral Gradients on the Bowing of an Optical Fiber: Analytical and Finite Element Modeling", Optical Engineering, vol. 39, No. 12, 2000
E. Suhir, “Predicted Fundamental Vibration Frequency of a Heavy Electronic Component Mounted on a Printed Circuit Board”, ASME J. Electr. Packaging (JEP),  vol.122, No.1, 2000
E.Suhir, “Modeling of the Mechanical Behavior of Materials in “High-Tech” Systems: Attributes and Review”, ASME J. Electr. Packaging (JEP),  vol.121, No.3, 2000
E. Suhir, “Thermal Stress Modeling in Microelectronics and Photonics Packaging, and the Application of the Probabilistic Approach: Review and Extension”, IMAPS Int. J. Microcircuits and Electronic Packaging, vol.23, No.2, 2000 (invited paper)
E. Suhir, “Predicted Stresses in, and the Bow of, a Circular Substrate/Thin-Film System Subjected to the Change in Temperature”,  J. Appl. Physics, vol.88, No.5, 2000
E.Suhir, “Optical Fiber Interconnect with the Ends Offset and Axial Loading: What Could Be Done to Reduce the Tensile Stress in the Fiber”?, J. Appl. Physics, vol.88, No.7, 2000
E. Suhir, “Adhesively Bonded Assemblies with Identical Nondeformable Adherends and “Piecewise Continuous” Adhesive Layer: Predicted Thermal Stresses and Displacements in the Adhesive”, Int. J.  Solids and Structures, vol.37, 2000

1999

E. Suhir, “Adhesively  Bonded Assemblies with Identical Nondeformable Adherends: Predicted Thermal Stresses in the Adhesive Layer”, Composite Interfaces, vol.6, No.2, 1999
E. Suhir, “Optimized Configuration of an Optical fiber “Pigtail” Bent on a Cylindrical Surface”, in T. Winkler and A, Schubert, eds., “Materials Mechanics, Fracture Mechanics, Micromechanics”, An Anniversary Volume in Honor of B. Michel’s 50th Birthday, Fraunhofer IZM, Berlin, 

1998

E. Suhir, “Adhesively Bonded Assemblies with Identical Nondeformable Adherends and Inhomogeneous  Adhesive Layer: Predicted Thermal Stresses in the Adhesive”, J. Reinforced Plastics and Composites, vol.17, No.14, 1998
E. Suhir, “Fiber Optic Structural Mechanics – Brief Review”, Editor’s Note, ASME J. Electr. Packaging (JEP), September 1998.
E. Suhir, “The Future of Microelectronics and Photonics and the Role of Mechanics and Materials”, ASME J. Electr. Packaging (JEP),  March 

1997

E. Suhir, "Bending of a Partially Coated Glass Fiber Subjected to the Ends Off-Set", IEEE CPMT Transactions, June 1997.
E. Suhir, “Predicted Thermal Mismatch Stresses in a Cylindrical Bi-Material Assembly Adhesively Bonded at the Ends”, ASME J. Appl. Mech., vol.64, No. 1, 1997.
E. Suhir, “Is the Maximum Acceleration an Adequate Criterion of  the Dynamic Strength of a Structural Element in an Electronic Product?”, IEEE CPMT Transactions, Part A, vol.20, No.4, December 1997.
E. Suhir, “Probabilistic Approach to Evaluate Improvements in the Reliability of Chip-Substrate (Chip-Card) Assembly“, IEEE CPMT Transactions, Part A, vol. 20, No. 1, 1997.
E. Suhir, “Failure Criterion for Moisture-Sensitive Plastic Packages of Integrated Circuit (IC) Devices: Application of von-Karman Equations with Consideration of Thermoelastic Strains”, Int. Journal of Solids and Structures, vol. 34, No. 12, 1997

1996

E. Suhir, “Predicted Curvature and Stresses in an Optical Fiber Interconnect Subjected to Bending”, IEEE/OSA Journal of Lightwave Technology, vol. 14, No. 2, 1996
E. Suhir, “Dynamic Response of a One-Degree-of-Freedom Linear System to a Shock Load during Drop Tests: Effect of Viscous Damping”, IEEE CPMT Transactions, Part A, vol. 19, No.3, 1996
E. Suhir, “Shock-Excited Vibrations of a Conservative Duffing Oscillator with Application to Shock Protection in Portable Electronics”, Int. J. Solids and Structures, vol. 33, No. 24, 1996

1995

E. Suhir, “Analysis and Optimization of the Input/Output Fiber Configuration in a Laser Package Design”, ASME Journal of Electronic Packaging, vol. 117, No. 4, 1995
E. Suhir, “Shock Protection with a Nonlinear Spring”, IEEE CPMT Transactions, Advanced Packaging, Part B, vol. 18, No. 2, 1995
E. Suhir, “How Compliant Should a Die-Attachment Be to Protect the Chip From Substrate (Card) Bowing?”, ASME J. Electr. Packaging (JEP),  vol. 117, No. 1, 1995

1994

E. Suhir, “Approximate Evaluation of the Elastic Thermal Stresses in a Thin Film Fabricated on a Very Thick Circular Substrate”, ASME J. Electr. Packaging (JEP), vol. 116, No. 3, 1994
E. Suhir E., “Dynamic Response of a Rectangular Plate to a Shock Load, with Application to Portable Electronic Product,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol.17, No. 3, 1994.
E. Suhir, “Approximate Evaluation of the Interfacial Shearing Stress in Circular Double Lap Shear Joints, with Application to Dual-Coated Optical Fibers”, Int. Journal of Solids and Structures, vol. 31, No. 23, 1994
E. Suhir, “Thermally Induced Stresses in an Optical Glass Fiber Soldered into a Ferrule”, IEEE/OSA Journal of Lightwave Technology, vol. 12, No. 10, 1994
E. Suhir, “Pull Testing of a Glass Fiber Soldered into a Ferrule: How Long Should the Test Specimen Be?”, Applied Optics, vol. 33, No. 19, 1994
E. Suhir and R. Burke, “Analysis and Optimization of the Dynamic Response of a Rectangular Plate to a Shock Load Acting on Its Support Contour, With Application to Portable Electronic Products”, IEEE CHMT Transactions, Advanced Packaging, Part B, vol. 17, No. 3, 1994

1993

E. Suhir, “Can the Curvature of an Optical Glass Fiber be Different from the Curvature of Its Coating?”, Int. J. Solids and Structures, vol. 30, No. 17, 1993
E. Suhir, “Predicted Stresses and Strains in Fused Biconical Taper Couplers Subjected to Tension”, Applied Optics, vol. 32, No. 18, 1993
E. Suhir, “Analytical Modeling of the Interfacial Shearing Stress in Dual-Coated Optical Fiber Specimens Subjected to Tension”, Applied Optics, vol. 32, No. 16, 1993
E. Suhir, “Effect of the Nonlinear Stress-Strain Relationship on the Maximum Stress in Silica Fibers Subjected to Two-Point Bending”, Applied Optics, vol. 32, No. 9, 1993
E. Suhir, “Analytical Modeling of the Interfacial Shearing Stress During Pull-Out Testing of Dual-Coated Lightguide Specimens”, Applied Optics, vol. 32, No. 7, 1993
E. Suhir, “Predicted Bow of Plastic Packages of Integrated Circuit (IC) Devices”, J. Reinforced Plastics and Composites, vol. 12, Sept. 1993
V. Mishkevich and E. Suhir, “Simplified Approach to the Evaluation of Thermally Induced Stresses in Bi-Material Structures”, in E. Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, ASME Press, 1993
E. Suhir, C. Paola, W. M. MacDonald, “Input/Output Fiber Configuration in a Laser Package Design”, IEEE/OSA J. Lightwave Technology, vol. 11, No. 12, 1993

1992

E. Suhir, “Free Vibrations of a Fused Biconical Taper Lightwave Coupler”, Int. J. Solids and Structures, vol. 29, No. 24, 1992
E. Suhir, “Vibration Frequency of a Fused Biconical Taper (FBT) Lightwave Coupler”, IEEE/OSA Journal of Lightwave Technology, vol. 10, No. 7, 1992
E. Suhir, “The Effect of the Nonlinear Behavior of the Material on Two-Point Bending in Optical Glass Fibers”, ASME J. Electr. Packaging (JEP),  vol. 114, No. 2, 1992
E. Suhir, “Elastic Stability, Free Vibrations, and Bending of Optical Glass Fibers: The Effect of the Nonlinear Stress-Strain Relationship”, Applied Optics, vol. 31, No. 24, 1992
E. Suhir, “Response of a Flexible Printed Circuit Board to Periodic Shock Loads Applied to Its Support Contour”, ASME J. Appl. Mech, vol. 59, No. 2, 1992
E. Suhir, “Nonlinear Dynamic Response of a  Flexible Thin Plate to Constant Acceleration Applied to Its Support Contour, with Application to Printed Circuit Boards Used in Avionic Packaging”, Int. J. Solids and Structures, vol. 29, No. 1, 1992
E. Suhir and L. T. Manzione, “Predicted Bow of Plastic Packages Due to the Non-uniform Through-Thickness Distribution of Temperature”, ASME J. Electr. Packaging (JEP), vol. 114, No. 3, 1992

1991

E. Suhir, “Approximate Evaluation of the Elastic Interfacial Stresses in Thin Films with Application to High-Tc Superconducting Ceramics”, Int. J. Solids and Structures, vol. 27, No. 8, 1991
E. Suhir, “Stress Relief in Solder Joints Due to the Application of a Flex Circuit”, ASME J. Electr. Packaging (JEP),  vol. 113, No. 3, 199
E. Suhir, G. M. Bubel, and R. D. Tuminaro, “Predicted Curvature of the Glass Fiber from the Measured Curvature of Its Coating”, IEEE/OSA Journal of Lightwave Technology, vol. 9, No. 6, 1991
E. Suhir and L. T. Manzione, “Predicted Stresses in Wire Bonds of Plastic Packages during Transfer Moldings”, ASME J. Electr. Packaging (JEP), vol. 113, No. 1, 1991
E. Suhir “A Plate Contactor in a Mechanical Input/Output Connector Interface: How Small Can It Be?”, ASME J. Electr. Packaging (JEP), vol. 113, No. 1, 1991
E. Suhir and L. T. Manzione, “Mechanical Deformation of Lead Frame Assemblies in Plastic Packages during Molding”, ASME J. Electr. Packaging (JEP), vol. 113, No. 4, 1991

1990

E. Suhir, “Stresses in a Coated Fiber Stretched on a Capstan”, Applied Optics, vol. 29, No. 18, 1990
E. Suhir and J. M. Segelken, "Mechanical Behavior of Flip-Chip Encapsulants”, ASME J. Electr. Packaging (JEP), vol. 112, No. 4, 1990
E. Suhir, “Buffering Effect of Fiber Coating and Its Influence on the Proof-Test Load in Optical Fibers”, Applied Optics, vol. 29, No. 18, 1990
E. Suhir, “Mechanical Approach to the Evaluation of the Low Temperature Threshold of Added Transmission Losses in Single-Coated Optical Fibers”, IEEE/OSA J. Lightwave Techn., vol. 8, No. 6, 1990
E. Suhir, “Double-Sided Velcro-Type Input/Output Contactor Interface Design: Mechanical Behavior of Elastic Contactors”, ASME J. Electr. Packaging (JEP), vol. 112, No. 4, 1990
E. Suhir and B. Poborets, “Solder Glass Attachment in Cerdip/Cerquad Packages: Thermally Induced Stresses and Mechanical Reliability”, ASME J. Electr. Packaging (JEP), vol. 112, No. 2, 1990
E. Suhir, “How Long Should a Beam Specimen Be in Bending Tests?”, ASME J. Electr. Packaging (JEP), vol. 112, No. 1, 1990
E. Suhir, “Predicted Mechanical Behavior of High-Tc Superconducting Ceramic Films”, in T. Venkatesan, ed., “Processing of Films for High-Tc Superconducting Electronics”, SPIE, Vol. 1187, 1990
E. Suhir and T. M. Sullivan, “Analysis of Interfacial Thermal Stresses and Adhesive Strength of Bi-Annular Cylinders”, Int. J. Solids and Structures, vol. 26, No. 6, 1990
E. Suhir and W. E. Benedetto, “Mechanical Behavior of the “Euler” Test Probe”, ASME J. Electr. Packaging (JEP),  vol. 112, No. 1,1990

1989

E. Suhir, “Interfacial Stresses in Bi-Metal Thermostats”, ASME J. Appl. Mech., vol. 56, No. 3, September 1989
E. Suhir, “Analytical Modeling in Structural Analysis for Electronic Packaging: Its Merits, Shortcomings and Interaction with Experimental and Numerical Techniques”, ASME J. Electr. Packaging (JEP), vol. 111, No. 2, June 1989
E. Suhir, “Axisymmetric Elastic Deformations of a Finite Circular Cylinder with Application to Low Temperature Strains and Stresses in Solder Joints”, ASME J. Appl. Mech., vol. 56, No. 2, 1989
E. Suhir, “Applications of an Epoxy Cap in a Flip-Chip Package Design”, ASME J. Electr. Packaging (JEP), vol. 111, No. 1, 1989
E. Suhir, “Bending Performance of Clamped Optical Fibers: Stresses Due to the End Off-Set”, Applied Optics, vol. 28, No. 3, February 1989.
E. Suhir, “Can Power Cycling Life of Solder Joint Interconnections Be Assessed on the Basis of Temperature Cycling Tests?”, ASME J. Electr. Packaging (JEP),  vol. 111, No. 4, Dec. 1989.
E. Suhir, “Calculated Interfacial Stresses in Elongated Bi-Material Plates Subjected to Bending”, ASME J. Electr. Packaging (JEP),  vol. 111, No. 4, Dec. 1989.
E. Suhir, “Twist-off Testing of Solder Joint Interconnections”, ASME J. Electr. Packaging (JEP), vol. 111, No. 3, Sept. 1989.

1988

E. Suhir, “Stresses in Dual - Coated Optical Fibers”, ASME J. Appl. Mech., vol. 55, No. 10, 1988.
E. Suhir, “Spring Constant In the Buckling of Dual-Coated Optical Fibers”, IEEE/OSA J. Lightwave Technology., vol. 6, No. 7, 1988.
E. Suhir, “Effect of Initial Curvature on Low Temperature Microbending in Optical Fibers”, IEEE/OSA J. Lightwave Techn., vol. 6, No. 8, 1988.
E. Suhir, “An Approximate Analysis of Stresses in Multilayer Elastic Thin Films”, ASME J. Appl. Mech., vol. 55, No. 3, 1988.
E. Suhir, “On a Paradoxical Phenomenon Related to Beams on Elastic Foundation”, ASME J. Appl. Mech., vol. 55, No. 10, 1988.

1986

E. Suhir, “Stresses in Bi-Metal Thermostats”, ASME J. Appl. Mech., vol. 53, No. 3, Sept. 1986.
S. Luryi and E. Suhir, “A New Approach to the High-Quality Epitaxial Growth of Lattice - Mismatched Materials”, Applied Physics Letters, vol. 49, No. 3, July 1986.

1982

E. Suhir, “Shock-Excited Vibrations with Application to the Slamming Response of a Flexible Ship to a Regular Wave Packet”, SNAME J. Ship Research, vol. 26, No. 4, 1982.

1979

E. Suhir and V. Lapenas, “The Solution to the Brachistochrona Problem with Consideration of Friction”, Trans. of the National Res. Inst. of Engine Building, Kiev, Ukraine, 1979 (in Russian)
E. Suhir and V. Sapkauskas, “Optimal Design of Some Basic Structures Used in Feed-Stuff Machinery”, Trans. of the National Res. Inst. of Engine Building, Kiev, Ukraine, 1979 (in Russian).

1978

E. Suhir, “Bending Moments Due to Ship Whipping”, Transactions of the Central Res. Institute of Merchant Marine, No. 233, Leningrad, Russia, 1978 (in Russian).
E. Suhir, “Response Functions for Heaving, Pitching and Wave-Induced Bending Moments, with Consideration of the Hull Flexibility”,“Seaworthiness of Ships,” Collected Articles, The USSR Register of Shipping, Leningrad, Russia, 1978 (in Russian).
E. Suhir, “Vibration of Rectangular Plates Due to Random Shock Excitation”, “Spatial Structures”, Collected Articles, No. 11, Krasnoyarsk, Russia, 1978 (in Russian).

1977

E. Suhir and V. Sapkauskas, “Probabilistic Characteristics of the Reliability of Some Major Feed-Stuff Machinery Structures”, Trans. of the National Res. Inst. of Engine Building, Kiev, Ukraine, 1977 (in Russian)
E. Suhir, “Application of the Theory-of-Elasticity Methods for the Evaluation of Forces  Acting in the Channels of Granulating Machines”, Trans. of the National Res. Inst. of Engine Building, Kiev, Ukraine, 1977 (in Russian)
E. Suhir, “Nonlinear Vibrations of Plates Due to Shock Loads”, “Spatial Structures”, Collected Articles, No. 10, Krasnoyarsk, Russia, 1977 (in Russian)

1976

E. Suhir, “Wave Induced Motion and  Bending Moments For Flexible Ship Hulls”, Transactions of the Central Research Institute of Merchant Marine, No. 223, Leningrad, Russia, 1976 (in Russian).

1973

E. Suhir, “Standardized Hydrodynamic Loads Acting on the Freight Containers, Located on the Upper Deck", “Naval Architecture and Off-Shore Structures”, Collected Articles, No. 19, Kharkov University, Kharkov, Ukraine, 1973 (in Russian).

1972

E. Suhir, “Nonlinear Vibration of Rectangular and Circular Plates Under Impact Loads”, Transactions of the Institute of Naval Architecture, No. 46, Nikolaev, Ukraine, 1972 (in Russian)
E. Suhir, “Exact Solution to the Problem of Steady - State Vibrations of a Nonlinear Oscillator Subjected to Periodic Instantaneous Impulses”, “Naval Architecture and Ship Repair”, Collected Articles, No. 4, Institute of Maritime Engineers, Odessa, Ukraine, 1972 (in Russian).
E. Suhir, “Vibration of a Rectangular Plate Subjected to Lateral Periodic Impact Loads and Reactive Membrane Forces”, Transactions of the Institute of Naval Architecture, No.41, Nikolaev, Ukraine,  1972.(in Russian)
E. Suhir, “Evaluation of Wave Loads Acting on a Ship Side in Irregular Waves”, Transactions of the Institute of Naval Architecture, No. 41, Nikolaev, Ukraine, 1972 (in Russian).
E. Suhir, “Computerized Calculations of Motions and Bending Moments For a Ship in Nonlinear Heave and Pitch”, Transaction of the Institute of  Naval Architecture, Nikolaev, Ukraine, 1972 (in Russian).
E. Suhir, “Effect of Ship's Draft and Trim on Her Motions in Heave and Pitch”, “Naval Architecture and Off-Shore Structures”, Collected Articles, No. 9, Kharkov University, Kharkov, Ukraine, 1972 (in Russian).
E. Suhir, “Response of Partially Submerged Marine Propellers to Impact Hydrodynamic Loads”, “Naval Architecture and Off-Shore Structures”, Collected Articles, No. 9, Kharkov University, Kharkov, Ukraine, 1972 (in Russian).
E. Suhir, “About the Standardized Loading for Containers Carried on the Upper Deck”, Naval Architecture and Off-Shore Structures, Collected articles, X,  Kharkov State University, Issue 19, 1972 (in Russian)

1970

Y. Guliev, Y. Vorobyov, E. Suhir and Y. Elis, “Interaction Between Ship Models Passing Each Other In a Narrow Fairway”, “Naval Architecture and Ship Repair”, Collected Articles, No. 1, Institute of Maritime Engineers, Odessa, Ukraine, 1970 (in Russian).
E. Suhir, “Differential Equations of Motion For a Ship in Regular Head Waves”, “Theoretical and Practical Problems of Ship Seaworthiness”, Collected Articles, The USSR Register of Shipping, Leningrad, Russia, 1970 (in Russian).
E. Suhir, “Evaluation of the Hydrodynamic Load Acting on a Rapidly Immersing Body”, “Naval Architecture and Off-Shore Structures”, Collected Articles, No. 2, Kharkov University, Kharkov, Ukraine, 1970 (in Russian).
E. Suhir, “The Equations of Motion of a Body of Variable Form in Liquid, and Their Application to the Problem of Nonlinear Heaving and Pitching of Ships”, Naval Architecture and Off-Shore Structures”, Collected Articles, No. 2, Kharkov University, Kharkov, Ukraine, 1970 (in Russian).

1966

E. Suhir, “About the Hydrodynamic Loading on a Body During Its Rapid Immersion into Water”, Naval Architecture and Off-Shore Structures”, Collected articles, Kharkov State University, 1966 (in Russian)
E.Suhir, “Ship motion and bending in slamming condition”, “Strength of Ship Structures”, Collected Articles, Society of Naval Architects, issue 85, 1966  (in Russian)
E.Suhir “Equations of Motion of a body of a Variable Shape in Liquid, With Application to the Ship Motion in Heave and Pitch"-X: Kharkov State University, issue 2, 1966 (in Russian)

Peer Reviewed Conference Presentations

2017

E. Suhir, S. Yi, “Elastic Stability of a Dual-Coated Fiber-Optic Connector”, 2017 SPIE Photonics West, Feb.1,San Francisco, published in the SPIE Digital Library as part of the proceedings of the Silicon Photonics XII conference.
E. Suhir, S. Yi, ”Thermal Stress in an Optical Silica Fiber Embedded (Soldered) into Silicon”,  2017 SPIE Photonics West, Jan. 31, San Francisco, published in the SPIE Digital Library as part of the proceedings of the Silicon Photonics XII conference.
E. Suhir, S. Yi, “Predicted Lattice-Misfit Stresses in a Gallium-Nitride (GaN) Film”,   2017 SPIE Photonics West, Jan.30, San Francisco, published in the SPIE Digital Library as part of the proceedings of the Silicon Photonics XII conference.
E. Suhir, S. Yi, J. Nicolics, L. Bechou, W.Benhadjala, “How Swiftly Should Be a Product Repaired, so that Its Availability is not Compromised?”, EuroSimE, 2017, Dresden, Germany, submitted
E.Suhir, S.Yi, “Double Exponential Probability Distribution Function (DEPDF) and Its Applications to Human-in-the-Loop (HITL) Aerospace Problems: When Human Performance Is Imperative, Ability to Quantify It is a Must”, Special NDA Session at the AIAA SciTech Conf., Jan. 9-13, 2017, Gaylord Texan Resort & Convention Center,
E.Suhir, S.Yi, “Design-for-Reliability and Accelerated Testing of Aerospace Electronics: What Should Be Done Differently”, Special NDA Session at the AIAA SciTech Conf., Jan. 9-13, 2017, Gaylord Texan Resort & Convention Center, submitted
E.Suhir, S.Yi, J.Nicolics, “Statistics- and Reliability Physics Related Failure Rates”,  IRPS, Monterey, April 2-6, 2017, submitted
E.Suhir, S.Yi, J.Nicolics, “When Equipment Reliability and Human Performance Contribute Jointly to Vehicular Mission Success and Safety, Ability to Quantify Its Outcome is a Imperative”,   IRPS, Monterey, April 2-6, 2017, submitted

2016

E. Suhir, S. Yi, “Predicted Thermal Stresses in a TSV Design”, San-Francisco, CA, Nov.8-10, 2016
E.Suhir, S.Yi, “Probabilistic Design for Reliability of Medical Electronic Devices: Role, Significance, Attributes, Challenges”, IEEE Medical Electronics Symp., Portland, OR, Sept. 14-15, 2016
E. Suhir, L. Bechou, R. Ghaffarian, J. Nicolics, “Column-Grid-Array (CGA) Technology Could Lead to a Highly Reliable Package Design”, IEEE Aerospace Conference, Big Sky, Montana, March 5-12, 2016
E.Suhir, J.Nicolics, and S. Yi, "Probabilistic Predictive Modeling (PPM) of Aerospace Electronics (AE) Reliability: Prognostic-and-Health-Monitoring (PHM) Effort Using Bayes Formula (BF), Boltzmann-Arrhenius-Zhurkov (BAZ) Equation and Beta-Distribution (BD)", 2016 EuroSimE Conf., Montpelier, France, 2016
E. Suhir, M. Unger, L. Cvitkovich, and J. Nicolics, “Power Core Embedding a Plurality of IC Devices and Sandwiched Between Two Insulated Metal Substrates: Predicted Thermal Stresses”, 2016 EuroSimE Conf., Montpelier, France, 2016
E.Suhir, J.Nicolics, “Aerospace Electronics-and-Photonics (AEP) Reliability Has to be Quantified to be Assured”, AIAA SciTech Conf., San Diego, CA, January 2016

2015

E. Suhir, A. Bensoussan, J. Nicolics, “Bow-Free Pre-Stressed ALT Specimen”, SAE Conf., Seattle, WA, Sept. 22-24, 2015
E. Suhir, "Analytical Modeling Enables One to Explain Paradoxical Situations in the Behavior and Performance of Electronic Materials and Products" (keynote presentation), Int. Conf. on Materials, Processing and Products Engineering (MPPE), Leoben, Austria, Nov. 3-5, 2015
E. Suhir, G. Khatibi, J. Nicolics, M. Lederer, "Semiconductor Film Grown on a Circular Substrate: Predictive Modeling of the Lattice-Misfit Stresses”, Ibid.
A. Bensoussanm E. Suhir, P. Henderson, M. Zahir, “A Unified Multiple Stress Reliability Model for Microelectronic Devices: Application to 1.55 DFB Laser Diode Module for Space Validation”, ESREF, Toulouse, France, Oct. 2015
E. Suhir, A. Bensoussan, “Degradation Related Failure Rate Determined from the Experimental Bathtub Curve”, SAE Conf., Seattle, WA, Sept. 22-24,.2015
E. Suhir, “Human-in-the-Loop and Aerospace Navigation Success and Safety: Application of Probabilistic Predictive Modeling”, SAE Conf., Seattle, WA, Sept. 22-24, .2015
E. Suhir, “Failure Oriented Accelerated Testing (FOAT), and Its Role in Making a Viable VLSI Device into a Reliable Product, 2015 IEEE VLSI Test Symp. Silverado Resort and Spa, Napa, CA, April 27-29, 2015
E. Suhir, A. Bensoussan, G. Khatibi, J. Nicolics, “Probabilistic Design for Reliability in Electronics and Photonics: Role, Significance, Attributes, Challenges”, IRPS, Hyatt Regency Monterey Resort & Spa, Monterey, CA, USA, April 19-23, 2015
E. Suhir,  “Analytical Stress Modeling for TSVs in 3D Packaging”, Semi-Term, San-Jose, March 15-19, 2015
E. Suhir, L. Bechou, “Thermal Stress in an Electronic Package Sandwiched Between Two Identical Substrates”,  IEEE Aerospace Conference, Big Sky, Montana, March 5-12,  2015E
E. Suhir, “Assessment of Product’s Degradation Rate from the Measured Bathtub Curve Data”, 2015 IEEE Aerospace Conference, Big Sky, Montana, March 5-12, 2015
E. Suhir, “Analytical Predictive Modeling in Fiber Optics Structural Analysis: Review and Extension”, SPIE, San-Francisco, February 10, 2015
E. Suhir, “Stress Related Aspects of the Physics of GaN Material Growth”, SPIE, San-Francisco, February 10, 2015

2014

E.Suhir,” Reliability Physics and Probabilistic Design for Reliability (PDfR): Role, Attributes, Challenges”  EPTC 2014, Singapore, November 5th, 2014 (invited)
G. Khatibi, B.Czerny, J.Magnien, M.Lederer, E.Suhir, J. Nicolics, “Towards Adequate Qualification Testing of Electronic Products: Review and Extension”, EPTC 2014, Singapore, November 5th, 2014 (invited)
E. Suhir, A. Bensoussan, “Quantified Reliability of Aerospace  Optoelectronics”, SAE Aerospace Systems and Technology Conference, September 23-25 2014 — Cincinnati, OH, USA
Z. Remili, Y. Ousten, B. Levrier, D. Mercier, E. Suhir, L. Bechou, “Thermo-mechanical Stress Analysis of Copper/Silicon Interface in Through Silicon Vias using FEM simulations and experimental analysis”, IEEE CPMT ESTC Conference, Helsinki, 2014
 V. Murashev, S. Legotin, K. Tapero, E.Suhir,  “Asynchronous Scanning Photo-receiver Based on Injection-Coupled Device”, 2014 ISROS Conference, June 2014
J.-M. Salotti, R. Hedmann, E.Suhir, “ Crew Size Impact on the Design, Risks and Cost of a Human Mission to Mars”, 2014 IEEE Aerospace Conference, Big Sky, Montana, March 2014
E.Suhir, A. Bensoussan, L. Bechou, “Aerospace Electronic Packaging: Thermal Stress in Bi- and Tri-Material Assemblies”, 2014 IEEE Aerospace Conference, Big Sky, Montana, March 2014
E.Suhir, A.Bensoussan, “Application of Multi-parametric BAZ Model in Aerospace Optoelectronics”, 2014 IEEE Aerospace Conference, Big Sky, Montana, March 2014
E. Suhir, A.Bensoussan, J.Nicolics, L.Bechou, “Highly Accelerated Life Testing (HALT), Failure Oriented Accelerated Testing (FOAT), and Their Role in Making a Viable Device into a Reliable Product”, 2014 IEEE Aerospace Conference, Big Sky, Montana, March 2014
J.-M. Salotti, E. Suhir, “Some Major Guiding Principles for Making  Future Manned Missions to Mars Safe and Reliable”, 2014 IEEE Aerospace Conference, Big Sky, Montana, March 2014
V. N. Murashev, P.A. Ivshin, S.A.Legotin, K. Tapero, E. Suhir, “Injection-coupled Devices (ICDs): Operation Principle, Applications, Design-for-Reliability”,  2014 IEEE Aerospace Conference, Big Sky, Montana, March 2014
D. Gucik-Derigny, A. Zolghadri. L. Bechou, E. Suhir, “Prediction of Remaining Useful Life (RUL) of Ball-Grid-Array (BGA) Interconnections During Testing on the Board Level”, 2014 IEEE Aerospace Conference, Big Sky, Montana, March 2014
E. Suhir, “Failure-Oriented-Accelerated-Testing (FOAT) and Its Role in Making a Viable Package into a Reliable Product”, SEMI-TERM 2014, San Jose, CA, March 9-13, 2014
D. Gucik-Derigny, A. Zolghadri, E. Suhir, L. Bechou, "A Model-Based Prognosis Strategy for Prediction of Remaining Useful Life of Ball-Grid-Array Interconnections", 19th World Congress of the International Federation of Automatic Control,  Cape Town, South Africa, August 24-29, 

2013

E. Suhir, L. Bechou,  “Saint-Venant’s Principle and the Minimum Length of a Dual-Coated Optical Fiber Specimen in Reliability (Proof) Testing”, ESREF, Arcachon, France, 2013 
E. Suhir, L. Bechou, A.Bensoussan, J. Nicolics “Photovoltaic Reliability Engineering: Qualification Testing (QT) and Probabilistic Design-for-Reliability (PDfR) Concept”,  invited presentation, 2013 SPIE PV Reliability Conference, San Diego CA, August 2013
W. Benhadjala, I. Bord-Majek, L. Béchou, E. Suhir, M. Buet, F. Rougé, V. Gaud. and Y. Ousten, “Effect of Processing Factors on Dielectric Properties  of BaTiO3/Hyperbranched Polyester Core-Shell Nano-Particles”, ECTC,  San Diego, May 2013
A. Bensoussan and E. Suhir, “Design-for-Reliability (DfR) of Aerospace Electronics: Attributes and Challenges",  2013 IEEE Aerospace Conference, Big Sky, Montana, March 2013
E. Suhir, “Assuring Aerospace Electronics and Photonics Reliability: What Could and Should Be Done Differently”, 2013 IEEE Aerospace Conference, Big Sky, Montana, March 2013
E. Suhir, “Predicted Reliability of Aerospace Electronics: Application of Two Advanced Probabilistic Techniques”, 2013 IEEE Aerospace Conference, Big Sky, Montana, March 2013
E. Suhir, L .Bechou, B. Levrier, D. Calvez, “Assessment of the Size of the Inelastic Zone in a BGA Assembly”, 2013 IEEE Aerospace Conference, Big Sky, Montana, March 2013
E. Suhir, “Elastic Stability of a Dual-Coated Fiber”, SPIE Paper #8621-37, Photonics West, February 2013

2012

E.Suhir, “Thermal Stress in Electronics and Photonics: Prediction and Prevention”, Keynote presentation, Therminic, Budapest, September 2012
E.Suhir, “Dynamic Response of Electronic Systems to Shocks and Vibrations: Application of Analytical (Mathematical) Modeling”, 2012 DYMAT Conference
E. Suhir, R. Mahajan, A. Lucero, L. Bechou, “Probabilistic Design for Reliability (PDfR) and a Novel Approach to Qualification Testing (QT)”, 2012 IEEE/AIAA Aerospace Conf., Big Sky, Montana, 2012
B. Nagl, E.Suhir, W. Gschohsmann, J.Nicolics, “Transient Thermo-Mechanical Study of a Thick-Wire Bond with Particular Attention to the Interfacial Shearing Stress”,  Int. Spring Seminar on Electronics Technology (ISSE), 09-13, Bad Aussee, Austria, May 2012
W. Benhadjala, I. Bord,  L. Béchou, E. Suhir,  M. Buet, F. Rougé,  Y. Ousten,  “Novel Core-Shell Nanocomposite for RF Embedded Capacitors:  Processing and Characterization”,  2012
ECTC , June 2012

2011

E.Suhir, "Human-in-the-Loop”: Likelihood of a Vehicular Mission-Success-and-Safety, and the Role of the Human Factor”, Paper ID 1168, 2011 IEEE/AIAA Aerospace Conference, Big Sky, Montana, March 5-12, 2011

2009

E. Suhir, “Stretchable Electronics: Does One Need a Good Thermal Expansion Match Between the Si Die and the Plastic Carrier?” , IEEE ECTC 
T. Reinikainen and E.Suhir, “Novel Shear Test Methodology for the Most Accurate Assessment of Solder Material Properties”, IEEE ECTC 2009
E. Suhir, “Lateral Compliance and Elastic Stability of a Dual-Coated Optical Fiber of Finite Length, with Application to Nano-Rods Embedded in Low-Modulus Elastic Media”, IEEE ECTC 2009 
E.Suhir, “Helicopter-Landing-Ship: Undercarriage Strength and the Role of the Human Factor”, ASME OMAE Conference, June 1-9, Honolulu, Hawaii, 2009;

2008

E. Suhir and S. Savastiuk, “Disc-like Copper Vias Fabricated in a Silicon Wafer:  Design for Reliability”,  58-th IEEE ECTC 2008

2007

E. Suhir, “Dynamic Response of Micro-Electronic Structural Elements to Shocks and Vibrations”, Keynote presentation, MicroNanoReliability Congress, Berlin-Koepenick, September 2-5, 2007
E. Suhir, “Polymer Coating of Optical Silica Fibers, and a Nanomaterial-Based Coating System”, Keynote Presentation,  Polytronic’2007, Proceedings of the International Conference on Polymeric Materials for Micro- and Opto-Electronics Applications, Tokyo, Japan, January 14-16, 

2006

Yi. Zhang, Yuan Xu, Claire Gu and Ephraim Suhir, “Predicted Shear-off Stress in Bonded Assemblies: Review and Extension” ASTR 2006, San Francisco, CA, 2006
E. Suhir, “Fiber Optics Structural Mechanics, and a New Generation of Nano-Technology Based Optical Fiber Cladding and Coating”, Invited talk at the Photonics West Conf., and SPIE Publication, 2006
E. Suhir, D. Ingman, “Highly Compliant Bonding Material and Structure for Micro- and Opto-Electronic Applications”, ECTC’06 Proceedings, San Diego, May 2006

2005

E. Suhir, “Analytical Thermal Stress Modeling in Physical Design for Reliability of Micro- and Opto-Electronic Systems: Role, Attributes, Challenges, Results”, Invited Talk, Therminic, 2005, Lago Maggiore, Italy, September 27-30, 2005
E. Suhir, “Mechanics of Coated Optical Fibers: Review and Extension”, ECTC’2005, Orlando, Florida, 2005
E. Suhir, “Microelectronic and Photonic Systems: Role of Structural Analysis”, InterPack’2005 Conference, San Francisco, July 2005
E. Suhir, “New Nano-Particle Material (NPM) for Micro- and Opto-Electronic Packaging Applications”, IEEE Workshop on Advanced Packaging Materials, Irvine, March 2005.

2004

E. Suhir, “Bow-Free Assemblies: Predicted Stresses”, Therminic’2004, Niece, France, Sept. 29-Oct.1, 2004
E. Suhir, “Polymer Coated Optical Glass Fiber Reliability: Could Nano-Technology Make a Difference?”, Polytronic’04, Portland, OR, September 13-15, 2004

2003

E. Suhir, “Thermal Stress Modeling in Micro- and Opto-Electronics: Review and Extension”, Invited Presentation, ASME Symposium Dedicated to Dr. Richard Chu, IBM, Washington, DC, November 2003

E. Suhir, “Polymer Coated Optical Glass Fibers: Review and Extension”, Proceedings of the POLYTRONIK’2003, Montreaux, October 21-24, 2003.

E. Suhir, V.Ogenko, D. Ingman, “Two-Point Bending of Coated Optical Fibers”, Proceedings of the PhoMat’2003 Conference, San-Francisco, CA, August 2003

E. Suhir, “How to Make a Photonic Device Into a Product: Role of Accelerated Life Testing”, Keynote Address at the International Conference of Business Aspects of Microelectronic Industry, Hong-Kong, January 2003.

2002

E.Suhir, “Could Shock Tests Adequately Mimic Drop Test Conditions?”, IEEE ECTC Conference Proceedings, San-Diego, CA, May 28-31, 2002

2001

E. Suhir, “Adequate Underkeel Clearance (UKC) for a Ship Passing a Shallow Waterway: Application of the Extreme Value Distribution (EVD)”, Proceedings of OMAE2001 Conference, Paper OMAE2001/S&R-2113, Rio de Janeiro, Brazil, 2001

2000

A. Katz, M. Pecht, E. Suhir, “Accelerated Testing in Microelectronics: Review, Pitfalls and New Developments”, Proceedings of the International Symposium on Microelectronics and Packaging, IMAPS, Israel, 2000
E.Suhir, “The Future of Microelectronics and Photonics, and the Role of Mechanical, Materials and Reliability Engineering”, Proceedings of the International Conference on Materials in Microelectronics, MicroMat 2000, April 17-19, 2000, Berlin, Germany
E.Suhir, “Silica Optical Fiber Interconnects: Design for Reliability”, Proceedings of the Annual Conference of the American Ceramic Society, St.-Louis, MO, May 3, 2000

1999

E.Suhir, “Elastic Stability of the Glass Fibers in a Micromachined Fiber-Optic Switch Packaged into a Dual-in-Line Ceramic Package”, ECTC, 1999

1998

E. Suhir, “Coated Optical Fiber Interconnect Subjected to the Ends Off-Set and Axial Loading”, International Workshop on Reliability of Polymeric Materials and Plastic Packages of IC Devices, Paris, Nov. 29- Dec.2, 1998, ASME Press, 1998.
E. Suhir, “Critical Strain and Postbuckling Stress in Polymer Coated Optical Fiber Interconnect: What Could Be Gained by Using Thicker Coating?”, International Workshop on Reliability of Polymeric Materials and Plastic Packages of IC Devices, Paris, Nov. 29- Dec.2, 1998, ASME Press, 1998.
E. Suhir, “Bending Stress in an Optical Fiber Interconnect Experiencing Significant Ends Off-Set”, MRS Symp. Proc., vol. 531, 1998.
E. Suhir, “Optical Fiber Interconnect Subjected to a Not-Very-Small Ends Off-Set: Effect of the Reactive Tension”, MRS Symposia Proceedings, vol. 531, 1998.
E. Suhir, “’Optical Glass Fiber Bent on a Cylindrical Surface”, MRS Symposia Proceedings, vol.531, 1998.

1997

E. Suhir, “Dynamic Response of Microelectronics and Photonics Systems to Shocks and Vibrations”, Proceedings of the International Conference on Microelectronics and Photonics Packaging, INTERPack’97, Hawaii, June 15-19, 1997.
E. Suhir, “Effect of Plastic Package Geometry on Its Propensity to Moisture Induced Failure”, IMAPS/NATO Workshop Proceedings, Bled, Slovenia, 1997
E. Suhir, “The Future of Microelectronics and Photonics and the Role of Mechanics and Materials”, Proceedings of the Electronic Packaging and Technology Conf., EPTC’97, Singapore, October 1997.
E. Suhir, "Bending of a Partially Coated Glass Fiber Subjected to the Ends Off-Set", Proc. of the 47-
th Electr. Comp. and Techn. Conference, IEEE, San Jose, CA, May 1997, see also IEEE CPMT Transactions, June 1997.
E. Suhir, “Solder Materials and Joints in Fiber Optics: Reliability Requirements and Predicted Stresses”, Proc. of the Int. Symp. on “Design and Reliability of Solders and Solder Interconnections”, Orlando, Fl., Febr. 1997.
M. Uschitsky and E. Suhir, “Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles”, in E. Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, ASME Press, 1997.

1996

B. Welker, M. Uschitsky, E. Suhir, S. Kher, G. Bubel, “Finite Element Analysis of the Optical Fiber Structures”, in E. Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, Symposium Proceedings, ASME Press, 1996
E. Suhir, “Flex
Circuit  vs  Regular” Substrate: Predicted Reduction in the Shearing Stress in Solder Joints”, Proc. of the 3-rd Int. Conf. on Flexible Circuits FLEXCON 96, San-Jose, CA, Oct. 1996.
M. Uschitsky, E. Suhir, L. Shepherd, W.R. Lambert, and M.A. Zimmerman, “Predicted Dynamic Strength and Durability of a Network Interface Unit (NIU) Enclosure”, in E. Suhir, ed., Structural Analysis in Microelectronics and Fiber Optics”, Symposium Proceedings, ASME Press, 1996.
E. Suhir, and Q.S.M. Ilyas, ““Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: How Different is Their Propensity to Moisture Induced Failures?”, in E. Suhir, ed., “Structural Analysis in Micro-electronics and Fiber Optics”, Symposium Proceedings, ASME Press, 1996.
M. Uschitsky, E. Suhir, “Predicted Thermally Induced Stresses in an Epoxy Molding Compound at the Chip Corner”, in E. Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, Symposium Proceedings, ASME Press, 1996.

1995

M. Uschitsky, E. Suhir, S. Kher, and G. Bubel, “Epoxy Bonded Optical Fibers: the Effect of Voids on Stress Concentration in the Epoxy Material”, in E. Suhir, ed., “Structural Analysis in Microelectronic and Fiber Optic Systems”, Symposium Proceedings, ASME Press, 1995.
E. Suhir, “Predicted Failure Criterion (von-Mises Stress) in Plastic Packages During
High Temperature Reflow Soldering”, 45-th ECTC Proceedings, Las Vegas, May 1995.
E. Suhir, V. Mishkevich, and J. Anderson, “How Large Should a Periodic External Load Be to Cause Appreciable Microbending Losses in a Dual-Coated Optical Fiber?”, in E. Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, Symposium Proceedings, ASME Press, 1995.
E. Suhir, “Global” and “Local” Thermal Mismatch Stresses in an Elongated Bi-Material Assembly Bonded at the Ends”, in E. Suhir, ed., “Structural Analysis in Microelectronic and Fiber-Optic Systems”, Symposium Proceedings, ASME Press, 1995.

1993

E. Suhir, “Mechanical Reliability of Flip-Chip Interconnections in Silicon-on-Silicon Multichip Modules”, IEEE Conference on Multichip Modules, IEEE, Santa Cruz, Calif., March 1993.
E. Suhir, “Predicted Interfacial Shearing Stress in Dual-Coated Optical Fiber Specimens Subjected to Tension”, Part 2, “The Case of a Specimen Embedded into Epoxy”, ANTEC-93,  May 1993, SPE, New Orleans, Louisiana.
E. Suhir, “Predicted Interfacial Shearing Stress in Dual-Coated Optical Fiber Specimens Subjected to Tension”, Part 1, “The Case of a Cylindrical Double Lap Shear Joint”, ANTEC-93, May 1993, SPE, New Orleans, Louisiana.

1992

E. Suhir and T. M. Sullivan, “Novel Technique for the Evaluation of the Adhesive Strength of the Epoxy Molding Compounds Used in Plastic Packaging”, 42-nd Electr. Comp. and Techn. Conf., IEEE, San-Diego, Calif., May 1992.
E. Suhir, “Mechanical Behavior and Reliability of Solder Joint Interconnections in Thermally Matched Assemblies”,  42-nd Electr. Comp. and Techn. Conf., IEEE, San-Diego, Calif., May 1992.
E. Suhir, “Predicted Bow of Plastic Packages of Integrated Circuit (IC) Devices”, 50-
th SPE Conf., SPE, Detroit, MI, May 1992. 

1991

E. Suhir, “Nonlinear Dynamic Response of a Flexible Printed Circuit Board to Shock Loads Applied to Its Support Contour”,  41-st Elect. Comp. and Techn. Conf., IEEE, Atlanta, Georgia, May 1991.
E. Suhir, “Mechanical Behavior of Materials in Microelectronic and Fiber Optic Systems: Application of Analytical Modeling-Review”, MRS Symposia Proc., vol. 226, 1991.

1990

E. Suhir and B. Poborets, “Solder Glass Attachment in Cerdip/Cerquad Packages: Thermally Induced Stresses and Mechanical Reliability”, 40th Elect. Comp. and Techn. Conf., Las Vegas, Nevada, May 1990;

1989

E. Suhir, “Calculated Stresses in Microelectronic and Fiber-Optic Structures”, Proc. of the 1st Pan American Congress of Applied Mechanics, American Academy of Mechanics, Rio de Janeiro, Brazil, January 1989.
E. Suhir, “Mechanical Behavior of Materials in Microelectronic and Fiber-Optic Systems: Application of Analytical Modeling-Review”, ASME 89-WA/EEP-16, 1989 Winter Annual Meeting, San-Francisco, December 1989.
E. Suhir, “Thermally Induced Stresses in Elongated Bi-Material Plates”, Applied Mechanics Reviews, 1989 Supplement, “Mechanics Pan America 1989, Selected and Revised Proceedings of the January 1989 Rio de Janeiro Pan American Congress of Applied Mechanics,  C. R. Steele, A. W. Leissa and M. R. M. Crespo de Silva, eds., vol. 42, No. 11, part 2, Nov. 1989.

1988

E. Suhir and J. M. Segelken, "Mechanical Behavior of Flip-Chip Encapsulants”, Semicon/East Technical Proc., Semiconductor Equipment and Materials International, Boston, Mass., Sept. 1988.
E. Suhir, “Could Compliant External Leads Reduce the Strength of a Surface Mounted Device?”, Proc. of the 38th
Electr. Comp. Conf., IEEE, Los Angeles, Calif., May 1988.
E. Suhir, “Calculated Stresses in Dual-Coated Fibers”, Proc. of the SPE 46th Annual Technical Conference, ANTEC '88, Atlanta, Georgia, May 1988.

1987

E. Suhir, “Die Attachment Design and Its Influence on the Thermally Induced Stresses in the Die and the Attachment”, Proc. of the 37th Elect. Comp. Conf., IEEE, Boston, Mass., May 1987.
E. Suhir and W. E. Benedetto, “Mechanical Behavior of the “Euler” Test Probe”, Preprint ASME 87-WA/EEP-5, 1987 Winter Annual Meeting, Boston, Mass., Dec. 1987. 

1986

E. Suhir, “Calculated Thermally Induced Stresses in Adhesively Bonded and Soldered Assemblies”,  Proc. of the Int. Symp. on Microelectronics, ISHM, 1986, Atlanta, Georgia, Oct. 1986.

E. Suhir, “Stresses in Adhesively Bonded Bi-material Assemblies used in Electronic Packaging,” Proceedings of the Electronic Packaging Materials Science Symposium II, Palo Alto, California, April 15-18, pp.133-138, 1986.

1985

E. Suhir, “Linear and Nonlinear Vibrations Caused by Periodic Impulses”, AIAA/ASME/ASCE/AHS 26th Structures, Structural
Dynamics and Materials Conference, Orlando, Florida, April 1985.

1979

E. Suhir, “Probability Distributions of Stresses Due to the Combined Action of Wave-Induced and Wave-Excited Hull Vibration Bending Moments”, Proc. of the National Conference on Strength and Vibration of Ship Structures, Research Soc. for Shipbuilding Industry, Leningrad, Russia, 1979 (in Russian)

1978

E. Suhir, “Ship Slamming in Regular Seas”, Proc. of the National Conference on Ship Structural Damage and Reliability, Far East Polytechnic Institute, Vladivostok, Russia, 1978 (in Russian)

1976

E. Suhir, “Evaluation of the Errors Caused by Substitution of a Short-Term Load by an Instantaneous Impulse for a Nonlinear One-Degree-of-Freedom Vibration System”, Proc. of the National Conference on Strength and Vibration of Ocean Structures, Research Society for Shipbuilding Industry, Leningrad, Russia, 1976 (in Russian)

1975

E. Suhir, “Stochastically Unstable Nonlinear Vibrations of  Rectangular Plates Due to Periodic Impacts”, Proc. of the National Conference on the Theory of Shells and Plates, Academies of Sciences of the USSR and the Georgian SSR,
Mezniereba, Tbilisi, Georgia, 1975 (in Russian)
E. Suhir, “Nonlinear Shock-Excited Vibrations of Rectangular Plates with Consideration of Higher Modes”, Proc. Of the  National Conference on the Damage and Reliability of Ship Structures, Far East Polytechnic Institute, Vladivostok, Russia, 1975 (in Russian)
E. Suhir and A. Serdyuchenko, “Longitudinal Distribution of  External Hydrodynamic Loads Causing Wave Excited Hull Vibration”, Proc. of the National Conference on Ship Structural Damage and Reliability, Far East Polytechnic Institute, Vladivostok, Russia, 1975 (in Russian).
E. Suhir, “Ship Motion and Wave Bending Moments with Consideration of the Hull Flexibility”, Proc. of the National Conference on Ship Hydrodynamics, Research Society for Shipbuilding Industry, Leningrad, Russia, 1975 (in Russian)

1974

E. Suhir, “Stochastic Approach to the Problem of  Nonlinear Vibrations of a One-Degree-of-Freedom System Subjected to Repetitive Impacts”, Proc. of the National Symposium on Nonlinear Mechanical Vibrations, Academies of Sciences of the USSR and the Ukrainian SSR, Naukova Dumka, Kiev, Ukraine, 1974 (in Russian)

1973

E. Suhir, V. Suslov and A. Leshchinsky, “Investigation of Stresses in the Deck Plating of a Trawler”, Proc. of the National Conference on Ship Structural Damage and Reliability, Far East Polytechnical Institute, Vladivostok, Russia, 1973 (in Russian).
E. Suhir, “Design and Calculation of Knee Joints For Sea-Going Ships”, Proc. of the National Conference on Ship Structural Damage and Reliability, Far East Polytechnic Institute, Vladivostok, Russia, 1973 (in Russian).
E. Suhir, “Response Function For Bending Moments Caused by Wave-Excited Hull Vibration”, Proc. of the National Conference on the Strength of Large Sea-Going Ships, Research Society for Shipbuilding Industry, Leningrad, Russia, 1973 (in Russian)

Articles in Trade Magazines

E. Suhir, “Relieving Stress in Flip-Chip Solder Joints”, Chip Scale Reviews, September-October, 2017
E.Suhir, “Avoiding Low-Cycle Fatigue in Solder Material Using Inhomogeneous Column-Grid-Array (CGA) Design”,  ChipScale Reviews, March-April 2016
E. Suhir, “Electronics Reliability Cannot Be
Assured, if it is not Quantified”, Chip Scale Reviews, March-April, 2014
E.Suhir, “Failure-Oriented-Accelerated-Testing (FOAT) and Its Role in Making a Viable IC Package into a Reliable Product”,  Circuits Assembly, July 2013
E. Suhir, L. Bechou, “Availability Index and Minimized Reliability Cost”, Circuit Assemblies, February 2013
E. Suhir, L. Bechou, A.Bensoussan, “Technical Diagnostics in Electronics: Application of Bayes Formula and Boltzmann-Arrhenius-Zhurkov Model”, Circuit Assembly, December 3,  2012
E. Suhir, “Electronic Product Qual Specs Should Consider Its Most Likely Application(s)”, Chip Scale Reviews, November 2012
E.Suhir, “Predictive Modeling is a Powerful Means to Prevent Thermal Stress Failures in Electronics and Photonics”, Chip Scale Reviews, vol.15, No.4, July-August 2011
E. Suhir, R. Mahajan, “Are Current Qualification Practices Adequate?“, Circuit Assembly, April 2011

E. Suhir, “Probabilistic Design for Reliability”, Chip Scale Reviews, vol.14, No.6, 2010
E. Suhir, “Reliability and Accelerated Life Testing”, Semiconductor International, February 1, 2005.
E.Suhir, “Inventive Leadership: Could a Good Engineer Become a Good Entrepreneur?”, ASME Mechanical Engineering, November 2005
E. Suhir, “Crossing the Lines, or Should We Just Mind Our Own Business?”, Feature Article, ASME Mech. Engineering, 2004
E.Suhir, “Analytical Stress-Strain Modeling in Photonics Engineering: Its Role,
A
ttributes and Interaction with the Finite-Element Method”, Laser Focus World, May 2002.
E. Suhir, “Thermo-Mechanical Stress Modeling in Microelectronics and Photonics”, Electronics Cooling, vol.7, No.4, 2001
E. Suhir, “Thermal Stress Failures in Microelectronics and Photonics: Prediction and Prevention”, Future Circuits International, issue 5, 1999  

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