EPHRAIM SUHIR, Ph.D.

Bell Laboratories, Physical Sciences and Engineering Research Division, Murray Hill, NJ, USA;
Portland State University, Depts. of Mech. and Mat., and Elect. and Comp. Engineering, Portland, OR, USA;
Technical University, Dept. of Electronic Materials, Vienna, Austria; and
ERS Co., 727 Alvina Ct., Los Altos, CA 94024, USA,  www.ERSuhir.com,
Tel. 650.969.1530, Cell. 408-410-0886, e-mail: suhire@aol.com   and  e.suhir@ieee.org

 



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Profile strength: all-star; RG score: 40.80 (higher than 97.5% of RG members); Downloads (“Reads”): 9,880; Citations: 3,912.

AREAS OF PROFESSIOINAL COMPETENCE (RESEARCH INTERESTS)  

  • Applied Mathematics, Applied and Mathematical Physics, Materials Science and Engineering, Applied Mechanics
  • Applied Probability, Probabilistic Analyses and Probability-Based Physical Designs of Electron Devices
  • Probabilistic Methods in Reliability Engineering, Probabilistic Risk Assessment and Management
  • Analytical (Mathematical) Modeling in Applied Science and Engineering
  • Photonics, Fiber Optics, Mechanics of Optical Fibers and Systems
  • Design for Reliability (DfR) of Electronic, Opto-Electronic and Photonic Systems
  • Composite and “Smart” Materials and Systems
  • Thin Film Mechanics and Physics
  • Shock and Vibration Analyses and Testing
  • Dynamic Response of Materials and Structures to Shocks and Vibrations
  • Thermal Stress Analysis, Prediction and Prevention of Thermal Stress Failures
  • Solder Materials and Solder Joint Interconnections in Electronic and Optical Engineering
  • Embedded Systems
  • Polymeric Materials in Electronics and Photonics
  • Photovoltaic and Thermo-Electric Modules: Physical Design for Reliability
  • Nanotechnologies and Nanomaterials
  • Stretchable (Large Area) Electronics and Photonics: Physical Design for Reliability
  • Lattice-Misfit Systems: Stress Analysis and Reliability Evaluations
  • Technical Diagnostics, Prognostics and Health Monitoring (PHM)
  • Vehicular (Automotive, Aerospace, Maritime) Electronics and Photonics: Design for Reliability
  • “Human-in-the-Loop”: Human-Equipment-Environment Performance and Interaction
  • Quantification of the Role of the Human Factor in Various Tasks, Missions and Situations
  • Avionics and Outer Space Psychology


PERSONAL DATA

US citizen (naturalized in 1985). Goal-oriented highly motivated and creative performer with proven leadership, administrative and coaching ability, extensive project and financial management experience, team player attitude, strong analytical and planning skills, effective communications (both written and verbal) and presentation skills, as well as excellent organizational, interpersonal, and negotiation capabilities. Possesses a thorough and in-depth understanding of the state-of-the-art in materials, mechanical, electrical, optical, information, telecommunication, reliability and related areas of engineering, of new and emerging technologies, and a clear vision for the most promising directions in the development of applied science and engineering. Works exceptionally well in dynamic and rapidly changing environments, under pressure and in short time frames. Performs effectively across multiple organizations, companies, and departments, with specialists from various disciplines and fields, and with people of different mentalities, origins, and cultural backgrounds. Good public speaker. Communicates his ideas well to any audience. Quick learner. Exhibits strong interest in, and possesses good knowledge of, foreign cultures, values, attitudes, and customs. Always willing to learn new things and has exceptional receptiveness to, and quick grasp of, new approaches and ideas. Has a sociable disposition and gets along well with peers, supervisors, and subordinates. Bi-lingual: English and Russian. Fluent in Ukrainian. Working knowledge of German.

EDUCATION

  • Ph.D., Dept. of Mechanics and Mathematics,  Moscow State University, Moscow, Russia
  • MS, Dept. of Naval Architecture, Polytechnic Institute,  Odessa, Ukraine


MAJOR ACCOMPLISHMENTS

  • Pushed the envelope of applied and engineering mechanics, and applied materials’ science fields by developeding numerous predictive analytical models that are widely used by engineers and scientists worldwide in the physical design and stress analyses of electronic, photonic and MEMS materials, devices and systems


  • Made outstanding contributions to the permanent literature of engineering and created a new discipline - Structural Analysis of Electronic and Photonic Systems (see ASME Worcester Warner Medal Award citation)


  • Initiated a new fruitful direction in human and particularly in aerospace human psychology - quantitative probabilistic analysis of the outcome in various human-in-the-loop related missions and off-normal situations


  • Developed a new generation of moisture-resistant nano-materials, with application to optical-fiber coatings (three US patents)Organized and chaired numerous conferences, symposia and sessions, and taught courses in the field of reliability physics of electronic and optical materials worldwide


MEMBERSHIPS

  • National Academy of Engineering and Applied Science, Ukraine, Foreign Full Member (Academician)
  • Institute of Electrical and Electronics Engineers (IEEE), Life Fellow
  • American Society of Mechanical Engineers (ASME), Life Fellow
  • International  Microelectronics and Packaging Society  (IMAPS), Life Fellow
  • Institute of Physics (IoP, UK), Fellow
  • American Physical Society (APS), Fellow
  • Society of Optical Engineers (SPIE), Fellow
  • Society of Plastics Engineers (SPE), Fellow
  • American Institute of Aeronautics and Astronautics (AIAA), Associate Fellow
  • Surface Mount Technology Association (SMTA), Member
  • Society of Automotive Engineers (SAE), Member


 AWARDS

  • 2017 IMAPS Daniel C. Hughes, Jr. Memorial Award, the highest, most prestigious annual honor, awarded to the individual who has the greatest combination of technical achievements related to microelectronics, combined with outstanding contributions supporting the microelectronics industry, academic achievement, or support and service to IMAPS.  Recipients of this award automatically become Life Members and Fellows of the Society. Bestowed at the IMAPS award presentation ceremony at the 50th Int. Symp. on Microelectr., Raleigh, NC, October 10, 2017
  • 2017 Exceptional Technical Achievement (ETA) Award “for the development of numerous probabilistic design concepts that enable effective and rapid assessment of the probability of failure of electronic products", bestowed at the IEEE ECTC, Lake Buena Vista, Florida (USA), June 1, 2017. 
  • 2016 ASME Electronic and Photonic Packaging Division (EPPD) Excellence-in-Mechanics Award “to recognize outstanding contributions to the applications of applied and engineering mechanics to the field of electronic packaging and for contributions to professional activities of electronic and photonic packaging division”, bestowed at the ASME 2016 Int. Mech. Eng. Congress and Exposition (IMECE), Phoenix, AZ, Nov.16, 2016
  • 2016 ASME Santa Clara Valley Section Technical Talk Speaker Award “in recognition of your exemplary service and dedication to the highest standards of excellence”; bestowed at the ASME Industry Honors Dinner, Santa Clara, May 05, 2016
  • 2015 AIAA Associate Fellowship Award “for valuable contributions to the arts, sciences, and technology of aeronautics and astronautics”
  • 2015 ASME Santa Clara Valley Section Invited Speaker Award “for presenting ASME-SCVS Professional Development Seminars”; bestowed at the ASME Industry Honors Dinner, April 09,
  • 2014 IEEE CPMT Society Award “for delivering the short course at the 16-th Electronic Packaging Technology Conference”, December 3-5, Singapore
  • 2014 IEEE CPMT Society Award “in appreciation of sustained contribution to the ECTC, 25 Years”
  • 2014 ASME Santa Clara Valley Section Invited Speaker Award “for presenting ASME-SCVS Professional Development Seminars”; bestowed at the ASME Industry Honors Dinner, April 17
  • 2012 SPIE Fellowship Award “for outstanding and pioneering contributions to photonics engineering”
  • 2012 IMAPS Fellowship Award “for distinguished contributions to packaging of microelectronic devices”
  • 2012 ASME Santa Clara Valley Section Outstanding Achievement Award “for outstanding contribution to the engineering community”; bestowed at the ASME Industry Honors Dinner, April 19
  • 2009 IEEE CPMT Society Award “in appreciation of sustained contribution to the ECTC, 10 Years”
  • 2008 Fulbright Scholarship in Information Technologies, “as pertinent to the materials and structures in; reliability, physical design, packaging, and modeling of; and risk analyses and probabilistic assessments for, the evaluation of the behavior and performance of hardware and devices in information and communication technologies and systems”
  • 2004 ASME Worcester Reed Warner Medal for “outstanding contributions to the permanent literature of engineering through a series of papers in Mechanical, Microelectronic, and Optoelectronic Engineering, which established a new discipline known as the Structural Analysis of Microelectronic and Photonic Systems” 
  • 2004 ASME  Award “for valued services in advancing engineering education as Member-at-Large of the Professional Development Board”
  • 2002 Laser Focus World Award for the paper “Analytical Modeling Plays a Crucial Role in Photonics Engineering”, May   
  • 2002 APS Fellowship Award “for distinguished contributions to the field of analytical modeling of the physical behavior and reliability of microelectronic and photonic materials and systems”.
  • 2001 IMAPS John A. Wagnon Technical Achievement Award “for outstanding contributions to the technical knowledge of the microelectronics, optoelectronics, and packaging industry by advancing the art and science of predictive modeling in these areas, and laying the foundation of a discipline "Structural Analysis in Microelectronics and Photonics Systems” and for providing leadership in the application of Engineering and Applied Mechanics principles and methods to problems of physical design in microelectronics and photonics”.
  • 2001 ASME Award for valued services in advancing the engineering profession as keynote speaker on the topic “The Future of Microelectronics and Photonics, and the Role of Packaging”
  • 2000 IEEE-CPMT Outstanding Sustained Technical Contribution Award “for outstanding, sustained and continuing contributions to the technologies in fields encompassed by the CPMT Society, and as a recognition of the pioneering work in Materials and Mechanical Engineering related to microelectronics and fiber-optics structures
  • 2000 SPE International Engineering/Technology (Fred O. Conley) Award “for outstanding pioneering and continuing contributions to plastics engineering”
  • 1999 ASME (National) Charles Russ Richards Memorial Award “for outstanding contributions to mechanical engineering”
  • 1998 SPE Fellowship Award “for distinguished contributions to the scientific and engineering knowledge related to plastics”
  • 1998 IEEE CPMT Distinguished Lecturer Award “for teaching successful short courses and tutorials, and presenting invited and key-note talks in the field of Physical (Mechanical) Design and Reliability of Microelectronic and Photonic Systems”
  • 1997 ASME INTERPack’97 General Chair Award “for organizing and conducting the  International Conference on Microelectronics and Photonics Packaging, Hawaii, June 15-19”
  • 1996 Bell Labs Distinguished Member of Technical Staff Award “for developing engineering mechanics methods to predict the performance and reliability of structures, and in manufacturing Lucent Technologies products”, Bell Laboratories
  • 1996 ASME Fellowship Award “for outstanding pioneering contributions to several important fields of Applied and Engineering Mechanics, and Materials Science and Engineering”,
  • 1994 IEEE Fellowship Award “for distinguished contributions to the field of the application of Engineering Mechanics and Materials Engineering to the analysis and physical design of microelectronic and fiber optic systems”,
  • 1994, 1995, 1996 ASME Awards “for valued services in advancing the engineering profession as Member of the Executive Committee and Chairman of the Honors and Awards Committee, ASME, Electrical and Electronic Packaging Division”.
  • 1994 ASME  Materials Division Award “for valued services in advancing the engineering profession and for presenting the highlight topic lecture  "The Future of Microelectronics and Fiber Optics and the Role of Materials and Mechanics''”, International Mechanical Engineering Congress and Exposition
  • 1993 AT&T Bell Laboratories Merit (Extraordinary Contribution) Award for “studies on modeling of stresses in, and optimization of manufacturing of, plastic electronic packages and optical fibers”
  • 1992 ASME Award “for distinguished contributions in the field of the application of Engineering Mechanics to Electronic Packaging, and for co-founding the Journal of Electronic Packaging”
  • 1990 Outstanding Paper Award “for a paper on mechanical design and reliability of ceramic electronic packages, Institute of Electrical and Electronic Engineers”
  • 1986 ISHM Best Paper Award “for a paper on thermal stresses in adhesively bonded and soldered assemblies, International Society for Hybrid Microelectronics”
  • 1986 Extraordinary Contribution Award “for studies on analytical stress modeling for advanced VLSI packages”, Bell Laboratories


UNIVERSITY COURSES TAUGHT

  • Applied Probability for Engineers and Physicists, Departments of Mathematics and Physics, Institute of Naval Architecture, Nikolayev, Ukraine, 1970-1975
  • Mathematical foundations of engineering elasticity and structural analysis, Departments of Mathematics and Structural Analysis, Nikolayev, Ukraine, 1970-1975
  • Probabilistic methods in ship structural analysis, Nikolayev, Ukraine,1970-1975
  • Nonlinear  and stochastic problems in mechanics and naval architecture, Department of Structural Analysis, Nikolayev, Ukraine, 1972-1975
  • Probability theory and its applications in engineering and applied science, Department of mathematics, Kaunas Polytechnic Institute, Kaunas, Lithuania, 1975-1979
  • Reliability of electronic and photonic materials, Rutgers University, Piscataway, New Jersey, USA, 1987-1990
  • Mechanical design, University of Pennsylvania, Philadelphia, USA, 1990-1992
  • Basics of Electronics Reliability, UC-Santa Cruz, Santa Cruz, CA, USA, 2002-2012;
  • Reliability Physics of Electronic and Optical Materials, Bordeaux University, Bordeaux, France, 2000-2014
  • Fundamentals of Optoelectronics and Photonics, UC-Santa Cruz, Santa Cruz, CA, USA, 2003-2004
  • Electronics and Photonics Materials: Applications and Reliability Physics, Technical University, Vienna, Austria, 1998-2016
  • Smart Systems Integration (SSI) Master Course, European Union supported, Budapest University of Technology, October-November 2014
  • Fundamentals of Electronics Reliability, Portland State University, March 2017


SOME NOTABLE ERS Co. PROJECTS

  • DARPA and NAVAIRSYSCOM,  Washington, DC, USA, ”Nanomaterial Based Coatings of Optical Fibers”, 2004-2006
  • Thales-Alenia, Toulouse, France,  ”Boltzmann-Arrhenius-Zhurkov (BAZ) Model and Its Applications to the Design-for-Reliability of Aerospace Optoelectronic Devices”, 2005-2015
  • Intel Corp., Santa Clara, CA, USA, ”Optimization of Drop Tests of Electronic Systems on the Board Level”,  2005-20014
  • IMS Lab., Bordeaux University,  Talence, France, ”Modeling of the Reliability of Lasers”, 2005-20013
  • Nokia Corp.,Manaus, Brazil, ”Reliability and Advanced Testing Methods for Portable Electronics”,  2006-2007
  • AT&S (Technologie & Systemtechnik Actiengesellschaft), Leoben, Austria, ”Modeling of Thermal Stresses in Embedded Components on the Way to Inustrialization of Power Electronics”, 2009-2015
  • Flextronix Corp., Milpitas, CA, USA, ”Design for Reliability of Si-Based Photovoltaic Devices”,  2011-2012
  • DARPA, Washington, DC, USA, ”Thermal and Lattice-Mismatch Models for GaN based Power Amlifiers”, 2012-2014
  • NASA JPL, Pasadena, CA, USA, ”Stress Relief in Solder Joints Owing to the Application of Column-Grid-Arrays”, 2014-2015
  • NASA  JPL, Pasadena, CA, USA, ”Stress Relief in Solder Joints Owing to the Application of Column-Grid-Arrays: Dynamic Loading”, 2016
  • NASA JPL, Pasadena, CA, USA, ”Remaining Useful Life (RUL) for PBGA/CGA/QFN Solder Joint Interconnections”, 2016
  • NASA JPL, Pasadena, CA, USA, ”Low Temperature - Random Vibration Testing Bias”, 2016-2017


SERVICE

  • Editorial Board Member:


IEEE CPMT Society (currently EPS) Transactions (1994-);
Hindawi Journal of Electrical and Computer Engineering (2012-);
Journal of Physical Mathematics (2012-);
Chinese Optical Letters (2014-),
Aerospace Journal (2014-);
Journal of Materials Research: Electronic Materials (2017-);
Int. Journal of Aeronautical Science & Aerospace Research (IJASAR) (2017-);
Int. Journal of Human Factors Modeling and Simulation (IJHFMS) (2017-);
American Research Journals, Inc. (2017-)
International Journal of Precious Engineering Research and Applications (2017-);
Contributing Editor, Chip Scale Reviews (2013-)
Editor, Silicon Valley Engineering Council (SVEC) Journal (2010)

  • Technical Editor,


ASME Journal of Electronic Packaging (1994-2002);
Springer’s book series on physics, mechanics and reliability of materials in micro- and opto-electronic systems (2006-);  
Co-founder (1985) and Senior Associate Technical Editor, ASME Journal of Electronic Packaging (1989-1994)
Distinguished Lecturer, IEEE CPMT Society (1995-)

  • Member,


IEEE TAB New Technology Directions Committee ( 1999-2007);
ASME General Awards Committee (2007-2015);  
IEEE CPMTS Fellowship Committee (2001-);
IEEE VTS Fellowship Committee (2011-2015); 
IEEE CPMTS Award Committee (2002-);
ASME Boards on Professional Developments, and on Research and Technology (2000-2004);
Advisory Committee, ASME Press, Monograph/Proceedings  Series on  "Materials, Molding, and Computation" (1992-2002);
Society of Automotive Engineers (SAE), Committees on Fiber Optics and Avionic Engineering (2004-);
Board of Governors, IEEE Components,  Packaging, and Manufacturing Technology Society (elected in 1996, re-elected in 2007);
Team of experts serving AT&T, Lucent Technologies, and Bell Laboratories R&D communities in Applied Mechanics, Applied Physics, Mechanical Behavior of Materials, Manufacturing Engineering, Mechanical and Reliability Engineering, and Applied Probability (1990-2001)

  • Chairman,


Group on Portable Information Devices, 
IEEE TAB New Technologies Direction Committee  (2005-2007);
IEEE VTS TC on Portable Devices (2007-2009);
Honors and Awards Committee, ASME Electrical and Electronic Packaging Division and K-16 Committee (Heat Transfer in Microelectronics) of the Heat Transfer Division (1991-2000);
New Technology Directions Committee, IEEE, Components, Packaging, and Manufacturing Technology (CPMT) Society (1998-2002)


COMMITTEES

Organizing committee member, general chair/co-chair, and/or session/track chair/co-chair for national and international meetings, conferences, and symposia, including, but not limited to (shortened list):

General Chair or Co-Chair:
·       IEEE CPMT ASTR Conferences, San-Francisco, CA, September 2011;  College Park, MD, October 2008;
·       IEEE Conference on Portable Information Devices, Portable’09, Anchorage, AK, September 2009;
·       IEEE/ASME/IMAPS Workshops on Reliability of Polymeric Materials and Plastic Packages of IC Devices, Paris, 1998, 1999, London, 2000;
·       International Conference on Electronic and Photonic Packaging (Interpack-97), Hawaii, 1997.
·       ASME Winter Annual Meetings, Division of Electrical and Electronic Packaging, Symposia on Structural Analysis in Electronic and Fiber-Optic Systems (1987- 2001)
·       IEEE Conference on Portable Devices and Polymeric Materials for Electronic and Photonic Applications, Garmisch-Partenkirchen, Germany, August 2008;
·       IEEE Conference on Portable Information Devices, Portable’07, Orlando, Florida, March 2007;
·       Accelerated Stress Testing and Reliability (ASTR) Workshop, ASTR’07, College Park, MD, October 2007
Co-Chair, Track on Thermal Phenomena in Electronic Systems, IEEE  Vehicular Power and Propulsion Conference (VPPC),  
·       Dearborn, MI, USA, September 2009;
·       Chicago, IL, USA, September  2011

Symposium Organizer, MRS Annual Meetings,
·       Symposium on Mechanical Behavior of Microelectronic Materials and Structures (Boston,1990),
·       Symposium on Reliability of Photonics Materials and Structures (San-Francisco, 1998),
·       Symposium on Optical Interconnects (San Francisco, 2012)
Organizing/Scientific/Steering Committee Member,
·       International Conference on Materials, Processing and Product Engineering, MPPE, Austria (2015-)
·       IEEE Workshop on Reliability of Polymeric Materials and Plastic Packages of IC Devices,  POLYTRONIK’ 2001, Potsdam, Germany;  2002, Budapest, Hungary; 2003, Monreaux, France; 2004, Portland, OR, USA; 2005, Wroclaw, Poland
·       THERMINIC,  European workshop on thermal phenomena in micro- and opto-electronic (1988-2014)
·       IEEE Annual Electronic Components and Technology Conferences, Electronic Packaging, Interconnection, and Reliability Committees (1988-present)
·       International Conferences on Electronic Packaging (San Jose, CA, 1990, Binghamton, NY, 1992, Hawaii, 1995, 1999)
Ø Session Organizer and Co-Chair, 2013, 2014, 2015, 2016 IEEE Aerospace Conference, Big Sky, Montana


PUBLICATIONS

23 patents, 16 books, 27 book chapters, 214 papers in archival journals, 132 edited conference papers, 16 articles in trade magazines (400+ publications totally), numerous invited, keynote and webinar presentations to different audiences and at different conferences, symposia and technical meetings worldwide.

Patents

1.      C. Dangelo, E. Suhir,  S. Dey, B. Wacker, Y. Xu, A. Boren, D. Olsen, Y. Zhang, P. Schwartz; B. Padmakumar,  “Carbon nanotube-based structures and methods for removing heat from solid-state devices”, US Patent #8,080,871, 2011

2.      E. Suhir, Y. Xu, Y. Zhang,  “ Method and apparatus for evaluation and improvement of mechanical and thermal properties of CNT/CNF arrays”, US Patent # 8,048,688, 2011

3.      E. Suhir, R. L. Kroeze, P. Schwartz, K. S. Ravindhran, “Composite carbon nanotube-based structures and methods for removing heat from solid-state devices”, US Patent #8,039,961, 2011

4.      E. Suhir, “Apparatus for Attaching a Cooling Structure to an Integrated Circuit”, US Patent #7,477,527, 2009

5.      D. Ingman, V. Ogenko, E. Suhir, A. Glista, “Moisture Resistant Nano-Particle Material and Its Applications”, US Patent #7,321,714B2, 2008

6.      E. Suhir, “Apparatus and Test Device for the Application and Measurement of Prescribed, Predicted and Controlled Contact Pressure on Wires”, US Patent #7,279,916, 2007

7.      D. Ingman and E.Suhir, “Optical Fiber with Nano-Particle Overclad”, US Patent, #7,162,138 B2, 2007

8.      D. Ingman and E.Suhir, “Optical Fiber with Nano-Particle Cladding”, US Patent, #7,162,137 B2, 2007

9.      E. Suhir, “Coated Optical Glass Fiber”, US Patent #6,647,195, 2003.

10.   E. Suhir, “Optical Fiber Interconnects Having Offset Ends with Reduced Tensile Strength and Fabrication Method”, US Patent #6,606,434, 2003

11.   E. Suhir, “Bi-Material Assembly Adhesively Bonded at the Ends and Fabrication Method”, US Patent #6,460, 753, 2002

12.   E. Suhir, “Strain Free Planar Optical Waveguides”, US Patent #6,389,209, 2002

13.   E.Suhir, “Apparatus and Method for Thermostatic Compensation of Temperature Sensitive Devices”, US Patent #6,337,932, 2002

14.   E.Suhir, “Method of Improving the Performance of Optical Fiber, which is Interconnected Between Two Misaligned Supports”, U.S. Patent #6,314,218, 2001

15.   E. Suhir, “Interconnected Optical Devices Having Enhanced Reliability”, U.S. Patent #6,327,411, 2001

16.   E. Suhir, “Arrangement for Reducing Bending Stress in an Electronics Package”, U.S. Patent #6,180,241, 2001

17.   E. Suhir, “Device and Method of Controlling the Bowing of a Soldered or Adhesively Bonded Assembly,” US Patent #6,239,382, 2001.

18.   E. Suhir, “Method for Determining and Optimizing the Curvature of a Glass Fiber for Reducing Fiber Stress”, US Patent #6,016,377, 2000

19.   E. Suhir,  "Electronic Assembly Having Improved Resistance to Delamination", U.S. Patent #6,028,772, 2000

20.   E. Suhir, “Method and Apparatus for Proof-testing Optical Fibers”, US Patent #6,119,527, 1998

21.   E. Suhir, “Data Carriers Having an Integrated Circuit Unit”, US Patent #5,703,350, 1997

22.   E. Suhir and J. Weld, “Electronic Package with Reduced Bending Stress”, US Patent #5,627,407, 1997.

23.   E. Suhir et al, “Pattern For Tube Bending”, Certificate of Authorship #487692, Official Bulletin of Inventions and Discoveries, State Committee for Inventions and Discoveries, No. 38, Moscow, Russia, 1975.

Books

24.   E. Suhir, “Human-in-the-Loop: Probabilistic Modeling of an Aerospace Mission/Situation Outcome”, signed agreement with CRC Press, Sept. 8, 2017

25.   E. Suhir, “Mechanical Behavior of Electronic Materials and Systems”, signed agreement with Springer, Sept. 8, 2017

26.   E. Suhir, D. Steinberg, T. Yi, eds., “Dynamic Response of Electronic and Photonic Systems to Shocks and Vibrations”, John Wiley, 2011

27.   X. Fan, E. Suhir, “Moisture Sensitive Plastic Packages of IC Devices”, Springer, 2010

28.   E. Suhir, CP Wong, YC Lee, eds. “Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability”, 2 volumes, Springer, 2008

29.   R. G. Driessen, J. G. Baets, J. G. McInerney, and E. Suhir, eds.“Laser Diodes, Optoelectronic Devices, and Heterogeneous Integration”, (SPIE),  2003

30.   E. Suhir, M. Fukuda, C. R. Kurkjian, eds., “Reliability of Photonic Materials and Structures”, Materials Research Society Symposia Proceedings, vol. 531, 1998.

31.   E. Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, ASME Press, 1997

32.   E. Suhir, “Applied Probability for Engineers and Scientists”, McGraw Hill, New York, 1997.

33.   E. Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, ASME Press, 1996

34.   E. Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, ASME Press, 1995

35.   M. Schen, H. Abe, and E. Suhir, eds. “Thermal and Mechanical Behavior and Modeling”, ASME, AMD-Vol,1994

36.   E. Suhir, “Structural Analysis in Microelectronic and Fiber Optic Systems”, vol.1, Basic Principles of Engineering Elasticity and Fundamentals of Structural Analysis”, Van Nostrand Reinhold, New York, 1991.

37.   E. Suhir, R.C. Cammarata, D.D.L. Chung, M.Jono, eds. “Mechanical Behavior of Materials and Structures in    Microelectronics”, Materials Research Society Symposia Proceedings, vol.226, 1991.

38.   E. Suhir, P. McSharry, “Soviet Naval Architecture: Theory and Applications of Hydrodynamics (Trans from Russian)”, 1986

39.   E. Suhir, Y. Raskin, A. Tunik, “Russian Strength Standards for Commercial Ships”, American Bureau of Shipping, 1982

Book chapters

40.   E. Suhir, “Mental Workload (MWL) vs. Human Capacity Factor (HCF): a Way to Quantify Human Performance”, in preparation

41.   E. Suhir, "What Could Possibly Be Done to Relieve Stress in the Second Level of Interconnection" (in preparation)

42.   E. Suhir, “Predicted Thermal and Lattice-Mismatch Stresses”, in T. Nishinaga and T.F.Kuech, eds., “Handbook of Crystal Growth”, 2e, vol.3, , Elsevier, 2015 

43.   E. Suhir, "Analysis of a Pre-Stressed Bi-Material Accelerated Life Test (ALT) Specimen", Encyclopedia of Thermal Stresses, R. Hetnarski, ed., Springer, 2013

44.   E. Suhir, "Thermal Stress in a Multi-Leg Thermoelectric Module (TEM) Design", Ibid.

45.   E. Suhir, "Thermal Stress in a Tri-Materilal Assembly with Application to Silicon-Based Photovoltaic Module (PVM)", Ibid.

46.   E. Suhir, "Thermoelastic Stability of an Embedded Nano-Fiber", Ibid.

47.   E. Suhir, “Linear Response to Shocks and Vibrations”, in E. Suhir, D. Steinberg and T. Yu, “Structural Dynamics of Electronic and Photonic Systems”, John Wiley, Hoboken, NJ., 2011

48.   E. Suhir, “Linear and Nonlinear Vibrations Caused by Periodic Impulses”. Ibid

49.   E. Suhir, “Random Vibrations of Structural Elements in Electronic and Photonic Systems”, Ibid

50.   C.Y.Zhou, T.X.Yu, S.W.Ricky Lee and E.Suhir, “Shock Test Methods and Test Standards for Portable Electronic Devices”, Ibid

51.   E. Suhir, “Shock Protection of Portable Electronic Devices Using a “Cushion” of an Array of Wires (AOW)”, Ibid

52.   M. Vujosevic and E.Suhir, “Dynamic Response of PCB Structures to Shock Loading in Reliability Tests”, Ibid

53.   E. Suhir, “Linear Response of a Single-Degree-of-Freedom System to an Impact Load: Could Shock Tests Adequately Mimic Drop Test Conditions?”, Ibid

54.   E. Suhir and L. Arruda, “Could an Impact Load of Finite Duration Be Substituted with an Instantaneous Impulse”? Ibid

55.   E. Suhir, “”Stretchable” Electronics: Predicted Thermo-Mechanical Stresses in the Die”,  Fraunhofer  Institute, Volume Dedicated to the 60-th Birthday of Prof. B. Michel, Berlin, Germany, 2009

56.   Y. Zhang, E. Suhir, C. Gu, “Physical Properties and Mechanical Behavior of  Carbon Nano-tubes (CNTs) and Carbon Nano-fibers  (CNFs) as Thermal Interface Materials (TIMs) for High Power Integrated Circuit (IC) Packages: Review and Extension, in C.P.Wong et al, eds, “Nano-Bio-Electronic, Photonic and MEMS Packaging”, Springer, 2009

57.   E. Suhir, “Fiber-Optics Structural Mechanics and Nano-Technology Based New Generation of Fiber Coatings: Review and Extension”, in E. Suhir, CP Wong, YC Lee, eds. “Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability”, 2 volumes, Springer, 2008

58.   E. Suhir, “Dynamic Response of Micro-Electronic Systems to Shocks and Vibrations: Review and Extension”, Ibid

59.   V. Birman and E. Suhir, “Effect of Material’s Nonlinearity on the Mechanical Response of Some Piezo-Electric and Photonic Systems”, Ibid

60.   E. Suhir, “Analytical Thermal Stress Modeling in Physical Design for Reliability of Micro- and Opto-Electronic Systems: Role, Attributes, Challenges, Results”, Ibid

61.   E. Suhir, “How to Make a Device into a Product: Accelerated Life Testing It’s Role, Attributes, Challenges, Pirfalls, and Interaction with Qualification Testing”, Ibid

62.   E. Suhir, D. Ingman, “Highly Compliant Bonding Material and Structure for Micro- and Opto-Electronic Applications”, Ibid

63.   E. Suhir, “Effect of Plastic Package Geometry on its Propensity to Moisture Induced Failure”, in R. Tummala, M. Kosec, W. Kinzy Jones and D. Belavic, eds., “Electronic Packaging for High Reliability: Low Cost Electronics”, NATO ASI Series, 3. “High Technology”, vol.57, Kluwer Academic Publishers, 1999.

64.   E. Suhir, “Structural Analysis in Fiber Optics”, in J. Menon, ed., “Trends in Lightwave Technology”, Council of Scientific Information, India, 1995.

65.   E. Suhir, “Predicted Bow of Plastic Packages of Integrated Circuit Devices”, in J. H. Lau, ed., Thermal Stress and Strain in Microelectronic Packaging”, Van Nostrand Reinhold, New York, 1993.

66.   E. Suhir and Y.C. Lee, “Thermal, Mechanical and Environmental Durability Design Methodologies in Electronic Packaging”, in “Handbook of Electronic Materials”, ASM International, 1990.

67.   E. Suhir, “Thermal Stress Failures in Microelectronic Components - Review and Extension”, in A. Bar-Cohen and A. D. Kraus, eds., “Advances in Thermal Modeling of Electronic Components and Systems”, Hemisphere, New York, 1988.

Archival (peer reviewed) journal papers

2017

68.   E.Suhir, “Statistical Failure Rate of an Electronic Product Comprised of Mass-Produced Components”, Int. J. of Reliability and Safety, submitted

69.   E.Suhir, “A Way to Quantify the Roles of the Two Major Aspects of the Human Factor: Human Error and His/Her State-of-Health”,   Int. J. of Human Factor Modeling and Simulation, submitted 

70.   E.Suhir, “What Could and Should Be Done Differently: Failure-Oriented-Accelerated-Testing (FOAT) and Its Role in Making an Aerospace Electronics Device into a Product”, Journal of Materials Science: Materials in Electronics, submitted

71.   E.Suhir, “Aerospace Electronics Reliability Prediction: Application of Two Advanced Probabilistic Techniques”, ZAMM, submitted

72.   E.Suhir, “Analytical Thermal Stress Model for a Typical Flip-Chip Package Design”, Journal of Materials Science: Materials in Electronics, submitted

73.   E. Suhir, “Flip-Chip Assembly: Is a Bi-Material Model Acceptable?”, Journal of Materials Science: Materials in Electronics, Vol. 28, No. 21, 2017.

74.   E.Suhir, “Analytical Modeling Enables Explanation of Paradoxical Behaviors of Electronic and Optical Materials and Assemblies”, Advances in Materials Research, vol.6, No.2, 2017

75.   E. Suhir, “Human-in-the-Loop: Application of the Double Exponential Probability Distribution Function Enables One to Quantify the Role of the Human Factor”, Int. J. of Human Factor Modeling and Simulation, v.5, No.4, 2017

76.   E. Suhir and R. Ghaffarian, “Predictive Modeling of the Dynamic Response of Electronic Systems to Impact Loading: Review”, ZAMM, 97, No. 6, 699–717, 2017

77.   E. Suhir, and S. Yi, “Probabilistic Design for Reliability (PDfR) of Medical Electronic Devices (MEDs): When Reliability is Imperative, Ability to Quantify it is a Must”, Journal of SMT, v. 30, Issue 1, 2017

78.   E. Suhir, S. Yi and R. Ghaffarian, “How Many Peripheral Solder Joints in a Surface Mounted Design Experience Inelastic Strains?”, Journal of Electronic Materials, v.46, No.3, 2017

79.   E. Suhir, “Static Fatigue Lifetime of Optical Fibers Assessed Using Boltzmann-Arrhenius-Zhurkov (BAZ) Model”, Journal of Materials Science: Materials in Electronics, v.28, No.16, 2017

80.   E. Suhir, R.Ghaffarian, S.Yi, and J.Nicolics “Assessed Interfacial Strength and Elastic Moduli of the Bonding Material from  Shear-off Test Data”, Journal of Materials Science: Materials in Electronics, v.28, No.9, 2017

81.   E. Suhir and R. Ghaffarian, “Solder Material Experiencing Low Temperature Inelastic Thermal Stress and Random Vibration Loading: Predicted Remaining Useful Lifetime”, Journal of Materials Science: Materials in Electronics, vol.28, No.4, 2017

82.   E. Suhir and R. Ghaffarian, “Probabilistic Palmgren-Miner Rule with Application to Solder Materials Experiencing Elastic Deformations”, Journal of Materials Science: Materials in Electronics, vol.28, No.3, 2017

83.   E. Suhir, R. Ghaffarian, and S. Yi, “Reliability Physics Behind the QFN State of Stress”, Journal of Materials Science: Materials in Electronics, v.28, No.2, 2017

2016

84.   E. Suhir, R. Ghaffarian, “Column-Grid-Array (CGA) vs. Ball-Grid-Array (BGA): Board-Level Drop Test and the Expected Dynamic Stress in the Solder Material”, Journal of Materials Science: Materials in Electronics, vol.27, No.11, 2016

85.   E. Suhir, S. Yi, G. Khatibi, J. Nicolics, M. Lederer, “Semiconductor Film Grown on a Circular Substrate: Predictive Modeling of Lattice-Misfit Stresses”, Journal of Materials Science: Materials in Electronics, vol.27, No.9, 2016

86.   E. Suhir, R. Ghaffarian, “Board Level Drop Test: Exact Solution to the Problem of the Nonlinear Dynamic Response of a PCB to the Drop Impact”,   Journal of Materials Science: Materials in Electronics, vol.27, No.9, 2016

87.   E.  Suhir, “Analytical Modeling Occupies a Special Place in the Modeling Effort”, Short Comm., J.Phys.Math., 7(1), 2016

88.   E. Suhir, J. Morris, L. Wang, and S. Yi, “Could the Dynamic Strength of a Bonding Material in an Electronic Device Be Assessed from Static Shear-Off Test Data?”, Journal of Materials Science: Materials in Electronics, vol.27, No.7, 2016

89.   E. Suhir, and J.Nicolics, “Power Core (PC) Embedding a Plurality of IC Devices and Sandwiched Between Two Dissimilar Insulated Metal Substrates (IMS’): Predicted Thermal Stresses”, Journal of Materials Science: Materials in Electronics, vol.27, No.7, 2016

90.   E. Suhir, “Bi-Material Assembly Subjected to Thermal Stress: Propensity to Delamination Assessed Using Interfacial Compliance Model”,  Journal of Materials Science: Materials in Electronics, vol.27, No.7, 2016

91.   E. Suhir, “Expected Stress Relief in a Bi-Material Inhomogeneously Bonded Assembly with a Low-Modulus-and/or-Low-Fabrication-Temperature Bonding Material at the Ends”, Journal of Materials Science: Materials in Electronics, vol.27, No.6, 2016

92.   E. Suhir, R. Ghaffarian, "Predicted Stresses in a Ball-Grid-Array (BGA)/Column-Grid-Array (CGA) Assembly with Epoxy Adhesive at Its Ends", Journal of Materials Science: Materials in Electronics, vol.27, No.5, 2016

93.   E. Suhir, “Bi-Material Assembly with a Low-Modulus-and/or-Low-Fabrication-Temperature Bonding Material at Its Ends: Optimized Stress Relief”, Journal of Materials Science: Materials in Electronics, vol.27, No.5, 2016

94.   E. Suhir, R. Ghaffarian, J. Nicolics,, “Predicted Stresses in Ball-Grid-Array (BGA) and Column-Grid-Array (CGA)  Interconnections in a Mirror-like Package Design”, Journal of Materials Science: Materials in Electronics, vol.27, No.3, 2016

95.   E. Suhir, R. Ghaffarian, J. Nicolics,  “Could Thermal Stresses in an Inhomogeneous BGA/CGA System be Predicted Using a Model for a Homogeneously Bonded Assembly?”, Journal of Materials Science: Materials in Electronics, vol.27, No. 1, 2016

2015

96.   E. Suhir,  "Predicted Stresses in a Ball-Grid-Array (BGA)/Column-Grid-Array (CGA) Assembly with a Low Modulus Solder at Its Ends", Journal of Materials Science: Materials in Electronics, vol.26, No.12, 2015

97.   E. Suhir, “Analytical Modeling Enables One to Explain Paradoxical Situations in the Behavior and Performance of Electronic Materials and Products: Review”,  Journal of Physical Mathematics 07(01) · Dec. 2015

98.   E. Suhir, “Analysis of a Short Beam with Application to Solder Joints: Could Larger Stand-off Heights Relieve Stress?”, European Journal of Applied Physics (EPJAP), vol. 71, 2015

99.   A. Bensoussan, E. Suhir, P. Henderson, M. Zahir, “A Unified Multiple Stress Reliability Model for Microelectronic Devices — Application to 1.55 μm DFB Laser Diode Module for Space Validation”,  Microelectronics Reliability, June 2015

100. E. Suhir, R. Ghaffarian, J. Nicolics, “Could Application of Column-Grid-Array Technology Result in Inelastic-Strain-Free State-of-Stress in Solder Material?”, Journal of Materials Science: Materials in Electronics, vol.26, No.12, 2015

101. E. Suhir, "Analytical Bathtub Curve with Application to Electron Device Reliability", Journal of Materials Science: Materials in Electronics, vol. 26, Issue 9, 2015.

2014

102. E. Suhir, “Human-in-the-loop (HITL): Probabilistic Predictive Modeling (PPM)  of an Aerospace Mission/Situation Outcome”, Aerospace, No.1, 2014

103. E. Suhir and A. Bensoussan, "Quantified Reliability of Aerospace Optoelectronics," SAE Int. J. Aerosp. 7(1), 2014

104. E. Suhir and J. Nicolics, “Analysis of a Bow-Free Pre-Stressed Test Specimen”, ASME JAM, vol.81, No.11, 2014

105. E. Suhir, “Three-Step Concept in Modeling Reliability: Boltzmann-Arrhenius-Zhurkov Physics-of-Failure-Based Equation Sandwiched Between Two Statistical Models”, Microelectronics Reliability, Oct. 2014

106. E. Suhir, “Compressed Cantilever Beam on an Elastic Foundation, with Application to a Dual-Coated Fiber-Optic Connector”, Int. Journal of Engineering Sciences, published on line, July 2014

107. E. Suhir, “Human-in-the-loop: Probabilistic Predictive Modeling, Its Role, Attributes, Challenges and Applications”, Theoretical Issues in Ergonomics Science (TIES), published on line, July 2014

108. E. Suhir, C. Bey, S. Lini, J.-M. Salotti, S. Hourlier, B. Claverie, “Anticipation in Aeronautics: Probabilistic Assessments”, Theoretical Issues in Ergonomics Science, published on line, June 2014

109. A. Ziabari, E.Suhir, A. Shakouri, “Minimizing Thermally Induced Interfacial Shearing Stress in a Thermoelastic Module with Low Fractural Area Coverage”, Microelectronics Reliability, Vol. 45, Issue 5, May 2014

110. E. Suihir, “Fiber Optics Engineering: Physical Design for Reliability”, Facta Universitatis: series Electronics and Energetics", Vol. 27, No 2, June 2014

111. E. Suhir, “Thermal Stress in Through-Silicon-Vias: Theory-of-Elasticity Approach”, Microelectronics Reliability, vol.54, 2014

112. E. Suhir, “Statistics- and Reliability-Physics-Related Failure Processes”, Modern Physics Letters B (MPLB), Vol. 28, No. 13, 2014

113. J.-M. Salotti and E. Suhir, “Manned Missions to Mars: Minimizing Risks of Failure”, Acta Astronautica,   Vol. 93, January 2014

2013

114. E. Suhir, S. Kang, J. Nicolics, C. Gu, A. Bensoussan, L. Bechou, “Predicted Thermal Stresses in a Cylindrical Tri-Material Body, with Application to Optical Fibers Embedded into Silicon",  J. of Electrical and Control Engineering, Vol.3 No.6, December 2013

115. E. Suhir, “Lattice-Misfit Stresses in a Circular Bi-Material Gallium-Nitride Assembly”, ASME J. Appl. Mech., vol.80, January 2013

116. E. Suhir, “How Long Could/Should be the Repair Time for High Availability?”, Modern Physics Letters B (MPLB), vol.27, Aug.30, 2013

117. E. Suhir, “Could Electronics Reliability Be Predicted, Quantified and Assured?” Microelectronics Reliab., No. 53, April 15, 2013

118. E. Suhir, S. Kang, “Boltzmann-Arrhenius-Zhurkov (BAZ) Model in Physics-of-Materials Problems”, Modern Physics Letters B (MPLB), vol.27, April 2013

119. E. Suhir, “Structural Dynamics of Electronics Systems”, Modern Physics Letters B (MPLB), Vol. 27, No. 7, March 2013

120. E. Suhir, “Thermal Stress Failures in Electronics and Photonics: Physics, Modeling. Prevention”, J. Thermal Stresses, June 3, 2013

121. E. Suhir, ”“Miracle-on-the-Hudson”: Quantified Aftermath”, Int. J. Human Factors Modeling and Simulation, April 2013

122. E. Suhir and  A.Shakouri, “Predicted Thermal Stresses in a Multi-Leg Thermoelectric Module (TEM) Design”, ASME J. Appl. Mech., vol. 80, March 2013

123. E. Suhir,  D. Shangguan, L. Bechou, “Predicted Thermal Stresses in a Tri-Material Assembly with Application to Silicon-Based Photovoltaic Module ”, ASME J. Appl. Mech., vol.80, March 2013

124. E. Suhir, L.Bechou, B. Levrier, “Predicted Size of an Inelastic Zone in a Ball-Grid-Array Assembly”, ASME J. Appl. Mech., vol. 80, March 

2012

125. W. Benhadjala, I. Bord-Majek, L. Bechou, E. Suhir, M.Buet, F. Rougé, V. Gaud, B. Plano, Y. Ousten, "Improved Performances of Polymer-Based Dielectric by Using Inorganic/Organic  Core-Shell Nanoparticles", Appl. Phys. Lett., 101, 142901, Oct. 2012

126. E. Suhir, A. Shakouri, “Assembly Bonded at the Ends:  Could Thinner and Longer Legs Result in a Lower Thermal Stress in a Thermoelectric Module (TEM) Design?”, ASME J. Appl. Mech., vol.79, No.6, 2012

127. E. Suhir, “When Reliability is Imperative, Ability to Quantify It is a Must”, IMAPS Advanced Microelectronics, August 2012

128. E. Suhir, D. Shangguan, L .Bechou, “Predicted Thermal Stresses in a Photovoltaic  Module (PVM)”, PV International (UK),  Second Quarter, May 2012

129. E. Suhir, J. Nicolics, “Bending of a Bi-Material Cantilever Beam, with Consideration of the Role of the Interfacial Shearing Stress”, ZAMM, vol.92, No.7, 2012

130. E. Suhir, “Likelihood of Vehicular Mission-Success-and-Safety”, J. of Aircraft, vol.49, No.1, 2012

2011

131. E. Suhir, “Remaining Useful Lifetime (RUL): Probabilistic Predictive Model”, Int. J. of PHM, vol 2(2), 2011

132. E. Suhir, W.Gschohsmann, J. Nicolics, “Analysis of a Bi-Material Strip”, Z. Angew. Math. Mech., 1 - 9 2011

133. E. Suhir, “Stresses in Bi-Material GaN Assemblies”, J. Appl. Physics, 110, published on line, 2011

134. E. Suhir, “Predicted Response of the Die-Carrier Assembly to the Combined Action of Tension and Bending Applied to the Carrier in Flexible Electronics”, ASME J. Appl. Mech., vol. 79, No.1, 2011

135. E. Suhir, C.Gu, L.Cao, “Predicted Thermal Stress in a Circular Adhesively Bonded Assembly with Identical Adherends”, ASME J. Appl. Mech, vol. 79, No.1, 2011

136. E. Suhir, “Elastic Stability of a Rod Supported by an Elastic Foundation, with Application to Nano-Composites”, ASME J. Appl. Mech, vol. 79, No.1, 2011

137. W. Gschohsmann, J. Nicolics, E. Suhir, “Deformations in Stretched Surface Mounted Ceramic Strips for Sensor Applications”, Microelectronics International, vol.28, Issue 3, 2011

138. E. Suhir, “Thermal Stress Failures: Predictive Modeling Explains the Reliability Physics Behind Them”, IMAPS Advanced Microelectronics, vol.38, No.4, July/August 2011

139. E. Suhir, “Predictive Modeling of the Dynamic Response of Electronic Systems to Shocks and Vibrations”, ASME Appl. Mech. Reviews, vol. 63, No.5, March, 2011

140. E. Suhir, “Analysis of a Pre-Stressed Bi-Material Accelerated Life Test (ALT) Specimen”, Zeitschrift fur Angewandte Mathematik und Mechanik (ZAMM), vol.91, No.5, 2011

141. E. Suhir and R. H. Mogford, “"Two Men in a Cockpit": Probabilistic Assessment of the Likelihood of a Casualty if One of the Two Navigators Becomes Incapacitated”, J. of Aircraft, vol.48, No.4, July-August 2011

2010

142. W. Gschohsmann, J. Nicolics,  E. Suhir, “Elastizitätsmodell eines keramischen Sensorstreifens bei longitudinaler Verformung”,  Elektrotechnik und Informationstechnik, Vol. 127, No.10, October 2010

143. E. Suhir, “Probabilistic Modeling of the Role of the Human Factor in the Helicopter-Landing-Ship (HLS) Situation”, Int. J. Human Factor Modeling and Simulation (IJHFMS), vol.1, Issue 3, 2010

144. E. Suhir, W. Gschohsmann, J. Nicolics, “Analysis of an Elongated Stretched Strip, With Application to a Strain-Gage Electrical Sensor Structure’, ZAMM, No.10, 2010

145. E.Suhir, “Predicted Stresses in Die-Carrier Assemblies in “Stretchable” Electronics: Is There an Incentive for Using a Compliant Bond?”,  ZAMM, No.10, 2010

146. E. Suhir and L.Arruda, “Could an Impact Load of Finite Duration Acting on a Duffing Oscillator Be Substituted with an Instantaneous Impulse?”, JSME J. Solid Mech. and Materials Engineering (JSMME), vol.4, No.9, 2010

147. E. Suhir and T. Reinikainen, “Interfacial Stresses in a Lap Shear Joint (LSJ): The “Transverse Groove Effect” (TGE)”, JSME J. Solid Mech. and Materials Engineering (JSMME), vol.4, No.8, 2010 

148. E. Suhir and M.Vujosevic, “Bi-Material Assembly Subjected to Tensile Forces and Bending Moments Applied to the Ends of One of Its Components”, JSME J. Solid Mech. and Materials Engineering (JSMME), vol.4, No.4, 2010

149. E. Suhir, “Optical Fiber Interconnects: Design for Reliability”, Society of Optical Engineers (SPIE), Proc. of SPIE, Vol. 7607 760717-8

2009

150. E. Suhir and L. Arruda, “The Coordinate Function in the Problem of the Nonlinear Dynamic Response of an Elongated Printed Circuit Board (PCB) to a Drop Impact Applied to Its Support Contour”, European J. Appl. Physics, vol.48, No.2, 2009

151. C.Y.Zhou, T.X.Yu, E.Suhir,  “Design of Shock Table Tests to Mimic Real-Life Drop Conditions”, IEEE CPMT Transactions, vol.32, No.4, 

152. Biswas, I.S. Bayer, A. Tripathi, E.H.Lock, S.G. Walton, M.G. Norton, D.K. Avasthi, D.H.Dahanayaka, L.A.Bumm, E.Suhir, A.R.   Chowdhury, R. Gupta, “Fabrication of Nanoelectric Composites Exhibiting Stable Capacitor Functions in the High Frequency (≥100MHz) Through Interfacial Polarization Interactions”, Nanoscience and Nanotechnology Letters, vol.1, 1-8, 2009

153. I.S. Biswas, D.H.Bayer, L.A. Dahanayaka, Z. Bumm, F, Li, R. Watanabe, Y. Sharma, A.S.. Xu, M.G. Norton, E. Suhir, “Tailored Polymer-Metal Fractal Nanocomposites: An Approach to highly Active SERS Substrates”, Nanotechnology, 20, 2009

154. E. Suhir, “On a Paradoxical Situation Related to Bonded Joints: Could Stiffer Mid-Portions of a Compliant Attachment Result in Lower Thermal Stress?”, JSME J. Solid Mech. and Materials Engineering (JSMME),   vol.3, No.7, 2009

155. E .Suhir, “Helicopter-Landing-Ship: Undercarriage Strength and the Role of the Human Factor”, ASME OMAE Journal, vol. 132, No.1,  Dec. 22,  2009

156. E. Suhir, “Probabilistic Modeling of the Role of the Human Factor in the Helicopter Landing Ship (HLS) Situation”, International Journal of Human Factor Modeling and Simulation (IJHFMS),  2009

157. E. Suhir, “Analytical Thermal Stress Modeling in Electronic and Photonic Systems”, ASME App. Mech. Reviews, invited paper, vol.62, No.4, 2009.

158. E. Suhir and T. Reinikainen, “Interfacial  Stresess and a  Lap Shear Joint (LSJ): The “Transverse Groove Effect” (TGE)”, JSME J. Solid Mech. and Materials Engineering (JSMME),  vol.3, No.6, 2009

159. E. Suhir,  M. Vujosevic, and T. Reinikainen,  “Nonlinear Dynamic Response of a “Flexible-and-Heavy” Printed Circuit Board (PCB) to an Impact Load Applied to Its Support Contour”, J. Appl. Physics, D, 42, No.4, 2009

160. E. Suhir, “Thermal Stress in a Bi-Material Assembly with a “Piecewise-Continuous” Bonding Layer: Theorem of Three Axial Forces”, J. Appl. Physics, D, 42, 2009

2008

161. E. Suhir and M. Vujosevic, “Interfacial Stresses in a Bi-material Assembly with a Compliant Bonding Layer”, J. Appl. Physics D, vol.41, 

162. E. Suhir and T. Reinikainen, “On a Paradoxical Situation Related to Lap Shear Joints: Could Transverse Grooves in the Adherends Lead to Lower Interfacial Stresses?”, J.  Appl. Physics D, vol.41, 2008

163. E. Suhir, “Lateral Compliance of a Compressed Cantilever Beam, with Application to Micro-Electronic and Fiber-Optic Structures”, J. Appl. Physics D, vol.41,No.1,  2008

164. I.S.Bayer, A.Biswas, J.B.Szczech, E.Suhir, M.G.Norton, “Radio Frequency Functional Capacitors Made of All-Organic Composites of Thiourea in Field-Responsive Polymers for Embedded Applications”, Applied Physics Letters, vol. 92, No.1, 2008.

2007

165. T. Mirer, D. Ingman, E. Suhir, “Reliability Improvement Through Nano-Particle-Material-Based Fiber Structures”, Optical Fiber Technology, v. 13, 2007

166. E. Suhir, “Elastic Stability of a Dual-Coated Optical Fiber of Finite Length”, J. Appl. Physics, vol.102, No.5, 2007

167. E. Suhir, “Response of a Heavy Electronic Component to Harmonic Excitations Applied to Its External Electric Leads”, Elektrotechnik & Informationstechnik (Austria), vol.9, 2007

168. E. Suhir, “Elastic Stability of a Dual-Coated Optical Fiber with a Stripped Off Coating at Its End”, Journal of Applied Physics, vol. 102, No.4, 2007

2006

169. E.Suhir, “Interfacial Thermal Stresses in a Bi-Material Assembly with a Low-Yield-Stress Bonding Layer”, Modeling and Simulation in Materials Science and Engineering, vol. 14, 2006

170. Y. Xu, Y. Zhang, E. Suhir, and X. Wang, ” Thermal Properties of Carbon Nanotube Array for Integrated Circuits Cooling” J. Appl. Physics, 100, 074302, 2006

171. Y. Zhang, Y. Xu and E. Suhir,  “Effect of Rapid Thermal Annealing (RTA) on Thermal Properties of Carbon Nanofibre (CNF) Arrays”, J. Appl. Physics D: Applied Physics ,39, 2006

172. Y. Zhang, Y. Xu and E. Suhir,  “Effective Young’s Modulus of Carbon Nano-Fiber Array”,  J. Materials Research (JMR),vol.21, No.11, Nov. 2006

173. Y. Zhang, E. Suhir, Y. Xu, and C. Gu, “ Bonding Strength of Carbon Nanofiber Array to its Substrate”,  JMR, vol. 21, No.11, Nov.2006

2003

174. E. Suhir, “Thermal Stress in an Adhesively Bonded Joint with a Low Modulus Adhesive Layer at the Ends”,  J.  Appl. Phys., April 2003

175. E. Suhir, “Modeling of Thermal Stress in Microelectronic and Photonic Structures: Role, Attributes, Challenges and Brief Review”, Special Issue, ASME J. Electr. Packaging (JEP), vol.125, No.2, June 2003

176. E. Suhir, “Bow Free Adhesively Bonded Assemblies: Predicted Stresses”, Electrotechnik & Informationtechnik, 120 (6), June 2003

2002

177. E. Suhir, “Accelerated Life Testing (ALT) in Microelectronics and Photonics: Its Role, Attributes, Challenges, Pitfalls, and Interaction With Qualification Tests”, ASME J. Electr. Packaging (JEP), Vol. 124, No. 3, 2002

178. E.Suhir, “Could Shock Tests Adequately Mimic Drop Test Conditions?”, J. Electr. Packaging (JEP), July, 2002

2001

179. E. Suhir, “Thermal Stress in a Polymer Coated Optical Glass Fiber with a Low Modulus Coating at the Ends”, J.  Mat. Res., vol. 16,  No. 10,   2001

180. M. Ushitsky, E. Suhir, G.W. Kammlott, “Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach”, ASME J.  Electr. Pack., vol.123, No.4, 2001

181. E. Suhir, "Analysis of Interfacial Thermal Stresses in a Tri-Material Assembly", J. Appl. Physics, vol.89, No.7, 2001

182. E. Suhir, “Thermal Stress in a Bi-Material Assembly Adhesively Bonded at the Ends”, J. Appl. Physics, vol. 89, No.1, 2001.

183. M. Uschitsky and E. Suhir, “Moisture Diffusion in Epoxy Molding Compounds Filled with Particles", ASME J. Electr. Pack., vol.123, No.1, 2001

2000

184. E. Suhir, “Microelectronics and Photonics – the Future”, Microelectronics Journal, vol.31, No.11-12, 2000

185. E. Suhir, and J.J. Vuillamin, Jr, "Effects of the CTE and Young's Modulus Lateral Gradients on the Bowing of an Optical Fiber: Analytical and Finite Element Modeling", Optical Engineering, vol. 39, No. 12, 2000

186. E. Suhir, “Predicted Fundamental Vibration Frequency of a Heavy Electronic Component Mounted on a Printed Circuit Board”, ASME J. Electr. Packaging (JEP),  vol.122, No.1, 2000

187. E.Suhir, “Modeling of the Mechanical Behavior of Materials in “High-Tech” Systems: Attributes and Review”, ASME J. Electr. Packaging (JEP),  vol.121, No.3, 2000

188. E. Suhir, “Thermal Stress Modeling in Microelectronics and Photonics Packaging, and the Application of the Probabilistic Approach: Review and Extension”, IMAPS Int. J. Microcircuits and Electronic Packaging, vol.23, No.2, 2000 (invited paper)

189. E. Suhir, “Predicted Stresses in, and the Bow of, a Circular Substrate/Thin-Film System Subjected to the Change in Temperature”,  J. Appl. Physics, vol.88, No.5, 2000

190. E.Suhir, “Optical Fiber Interconnect with the Ends Offset and Axial Loading: What Could Be Done to Reduce the Tensile Stress in the Fiber”?, J. Appl. Physics, vol.88, No.7, 2000

191. E. Suhir, “Adhesively Bonded Assemblies with Identical Nondeformable Adherends and “Piecewise Continuous” Adhesive Layer: Predicted Thermal Stresses and Displacements in the Adhesive”, Int. J.  Solids and Structures, vol.37, 2000

1999

192. E. Suhir, “Adhesively  Bonded Assemblies with Identical Nondeformable Adherends: Predicted Thermal Stresses in the Adhesive Layer”, Composite Interfaces, vol.6, No.2, 1999

193. E. Suhir, “Optimized Configuration of an Optical fiber “Pigtail” Bent on a Cylindrical Surface”, in T. Winkler and A, Schubert, eds., “Materials Mechanics, Fracture Mechanics, Micromechanics”, An Anniversary Volume in Honor of B. Michel’s 50th Birthday, Fraunhofer IZM, Berlin, 1999

1998

194. E. Suhir, “Adhesively Bonded Assemblies with Identical Nondeformable Adherends and Inhomogeneous  Adhesive Layer: Predicted Thermal Stresses in the Adhesive”, J. Reinforced Plastics and Composites, vol.17, No.14, 1998

195. E. Suhir, “Fiber Optic Structural Mechanics – Brief Review”, Editor’s Note, ASME J. Electr. Packaging (JEP), September 1998.

196. E. Suhir, “The Future of Microelectronics and Photonics and the Role of Mechanics and Materials”, ASME J. Electr. Packaging (JEP),  March 1998

1997

197. E. Suhir, "Bending of a Partially Coated Glass Fiber Subjected to the Ends Off-Set", IEEE CPMT Transactions, June 1997.

198. E. Suhir, “Predicted Thermal Mismatch Stresses in a Cylindrical Bi-Material Assembly Adhesively Bonded at the Ends”, ASME J. Appl. Mech., vol.64, No. 1, 1997.

199. E. Suhir, “Is the Maximum Acceleration an Adequate Criterion of  the Dynamic Strength of a Structural Element in an Electronic Product?”, IEEE CPMT Transactions, Part A, vol.20, No.4, December 1997.

200. E. Suhir, “Probabilistic Approach to Evaluate Improvements in the Reliability of Chip-Substrate (Chip-Card) Assembly“, IEEE CPMT Transactions, Part A, vol. 20, No. 1, 1997.

201. E. Suhir, “Failure Criterion for Moisture-Sensitive Plastic Packages of Integrated Circuit (IC) Devices: Application of von-Karman Equations with Consideration of Thermoelastic Strains”, Int. Journal of Solids and Structures, vol. 34, No. 12, 1997

1996

202. E. Suhir, “Predicted Curvature and Stresses in an Optical Fiber Interconnect Subjected to Bending”, IEEE/OSA Journal of Lightwave Technology, vol. 14, No. 2, 1996

203. E. Suhir, “Dynamic Response of a One-Degree-of-Freedom Linear System to a Shock Load during Drop Tests: Effect of Viscous Damping”, IEEE CPMT Transactions, Part A, vol. 19, No.3, 1996

204. E. Suhir, “Shock-Excited Vibrations of a Conservative Duffing Oscillator with Application to Shock Protection in Portable Electronics”, Int. J. Solids and Structures, vol. 33, No. 24, 1996

1995

205. E. Suhir, “Analysis and Optimization of the Input/Output Fiber Configuration in a Laser Package Design”, ASME Journal of Electronic Packaging, vol. 117, No. 4, 1995

206. E. Suhir, “Shock Protection with a Nonlinear Spring”, IEEE CPMT Transactions, Advanced Packaging, Part B, vol. 18, No. 2, 1995

207. E. Suhir, “How Compliant Should a Die-Attachment Be to Protect the Chip From Substrate (Card) Bowing?”, ASME J. Electr. Packaging (JEP),  vol. 117, No. 1, 1995

1994

208. E. Suhir, “Approximate Evaluation of the Elastic Thermal Stresses in a Thin Film Fabricated on a Very Thick Circular Substrate”, ASME J. Electr. Packaging (JEP), vol. 116, No. 3, 1994

209. E. Suhir E., “Dynamic Response of a Rectangular Plate to a Shock Load, with Application to Portable Electronic Product,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol.17, No. 3, 1994.

210. E. Suhir, “Approximate Evaluation of the Interfacial Shearing Stress in Circular Double Lap Shear Joints, with Application to Dual-Coated Optical Fibers”, Int. Journal of Solids and Structures, vol. 31, No. 23, 1994

211. E. Suhir, “Thermally Induced Stresses in an Optical Glass Fiber Soldered into a Ferrule”, IEEE/OSA Journal of Lightwave Technology, vol. 12, No. 10, 1994

212. E. Suhir, “Pull Testing of a Glass Fiber Soldered into a Ferrule: How Long Should the Test Specimen Be?”, Applied Optics, vol. 33, No. 19, 1994

213. E. Suhir and R. Burke, “Analysis and Optimization of the Dynamic Response of a Rectangular Plate to a Shock Load Acting on Its Support Contour, With Application to Portable Electronic Products”, IEEE CHMT Transactions, Advanced Packaging, Part B, vol. 17, No. 3, 1994

1993

214. E. Suhir, “Can the Curvature of an Optical Glass Fiber be Different from the Curvature of Its Coating?”, Int. J. Solids and Structures, vol. 30, No. 17, 1993

215. E. Suhir, “Predicted Stresses and Strains in Fused Biconical Taper Couplers Subjected to Tension”, Applied Optics, vol. 32, No. 18, 1993

216. E. Suhir, “Analytical Modeling of the Interfacial Shearing Stress in Dual-Coated Optical Fiber Specimens Subjected to Tension”, Applied Optics, vol. 32, No. 16, 1993

217. E. Suhir, “Effect of the Nonlinear Stress-Strain Relationship on the Maximum Stress in Silica Fibers Subjected to Two-Point Bending”, Applied Optics, vol. 32, No. 9, 1993

218. E. Suhir, “Analytical Modeling of the Interfacial Shearing Stress During Pull-Out Testing of Dual-Coated Lightguide Specimens”, Applied Optics, vol. 32, No. 7, 1993

219. E. Suhir, “Predicted Bow of Plastic Packages of Integrated Circuit (IC) Devices”, J. Reinforced Plastics and Composites, vol. 12, Sept. 1993

220. V. Mishkevich and E. Suhir, “Simplified Approach to the Evaluation of Thermally Induced Stresses in Bi-Material Structures”, in E. Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, ASME Press, 1993

221. E. Suhir, C. Paola, W. M. MacDonald, “Input/Output Fiber Configuration in a Laser Package Design”, IEEE/OSA J. Lightwave Technology, vol. 11, No. 12, 1993

1992

222. E. Suhir, “Free Vibrations of a Fused Biconical Taper Lightwave Coupler”, Int. J. Solids and Structures, vol. 29, No. 24, 1992

223. E. Suhir, “Vibration Frequency of a Fused Biconical Taper (FBT) Lightwave Coupler”, IEEE/OSA Journal of Lightwave Technology, vol. 10, No. 7, 1992

224. E. Suhir, “The Effect of the Nonlinear Behavior of the Material on Two-Point Bending in Optical Glass Fibers”, ASME J. Electr. Packaging (JEP),  vol. 114, No. 2, 1992

225. E. Suhir, “Elastic Stability, Free Vibrations, and Bending of Optical Glass Fibers: The Effect of the Nonlinear Stress-Strain Relationship”, Applied Optics, vol. 31, No. 24, 1992

226. E. Suhir, “Response of a Flexible Printed Circuit Board to Periodic Shock Loads Applied to Its Support Contour”, ASME J. Appl. Mech, vol. 59, No. 2, 1992

227. E. Suhir, “Nonlinear Dynamic Response of a  Flexible Thin Plate to Constant Acceleration Applied to Its Support Contour, with Application to Printed Circuit Boards Used in Avionic Packaging”, Int. J. Solids and Structures, vol. 29, No. 1, 1992

228. E. Suhir and L. T. Manzione, “Predicted Bow of Plastic Packages Due to the Non-uniform Through-Thickness Distribution of Temperature”, ASME J. Electr. Packaging (JEP), vol. 114, No. 3, 1992

1991

229. E. Suhir, “Approximate Evaluation of the Elastic Interfacial Stresses in Thin Films with Application to High-Tc Superconducting Ceramics”, Int. J. Solids and Structures, vol. 27, No. 8, 1991

230. E. Suhir, “Stress Relief in Solder Joints Due to the Application of a Flex Circuit”, ASME J. Electr. Packaging (JEP),  vol. 113, No. 3, 1991

231. E. Suhir, G. M. Bubel, and R. D. Tuminaro, “Predicted Curvature of the Glass Fiber from the Measured Curvature of Its Coating”, IEEE/OSA Journal of Lightwave Technology, vol. 9, No. 6, 1991

232. E. Suhir and L. T. Manzione, “Predicted Stresses in Wire Bonds of Plastic Packages during Transfer Moldings”, ASME J. Electr. Packaging (JEP), vol. 113, No. 1, 1991

233. E. Suhir, “A Plate Contactor in a Mechanical Input/Output Connector Interface: How Small Can It Be?”, ASME J. Electr. Packaging (JEP), vol. 113, No. 1, 1991

234. E. Suhir and L. T. Manzione, “Mechanical Deformation of Lead Frame Assemblies in Plastic Packages during Molding”, ASME J. Electr. Packaging (JEP), vol. 113, No. 4, 1991

1990

235. E. Suhir, “Stresses in a Coated Fiber Stretched on a Capstan”, Applied Optics, vol. 29, No. 18, 1990

236. E. Suhir and J. M. Segelken, "Mechanical Behavior of Flip-Chip Encapsulants”, ASME J. Electr. Packaging (JEP), vol. 112, No. 4, 1990

237. E. Suhir, “Buffering Effect of Fiber Coating and Its Influence on the Proof-Test Load in Optical Fibers”, Applied Optics, vol. 29, No. 18, 1990

238. E. Suhir, “Mechanical Approach to the Evaluation of the Low Temperature Threshold of Added Transmission Losses in Single-Coated Optical Fibers”, IEEE/OSA J. Lightwave Techn., vol. 8, No. 6, 1990

239. E. Suhir, “Double-Sided Velcro-Type Input/Output Contactor Interface Design: Mechanical Behavior of Elastic Contactors”, ASME J. Electr. Packaging (JEP), vol. 112, No. 4, 1990

240. E. Suhir and B. Poborets, “Solder Glass Attachment in Cerdip/Cerquad Packages: Thermally Induced Stresses and Mechanical Reliability”, ASME J. Electr. Packaging (JEP), vol. 112, No. 2, 1990

241. E. Suhir, “How Long Should a Beam Specimen Be in Bending Tests?”, ASME J. Electr. Packaging (JEP), vol. 112, No. 1, 1990

242. E. Suhir, “Predicted Mechanical Behavior of High-Tc Superconducting Ceramic Films”, in T. Venkatesan, ed., “Processing of Films for High-Tc Superconducting Electronics”, SPIE, Vol. 1187, 1990

243. E. Suhir and T. M. Sullivan, “Analysis of Interfacial Thermal Stresses and Adhesive Strength of Bi-Annular Cylinders”, Int. J. Solids and Structures, vol. 26, No. 6, 1990

244. E. Suhir and W. E. Benedetto, “Mechanical Behavior of the “Euler” Test Probe”, ASME J. Electr. Packaging (JEP),  vol. 112, No. 1,1990

1989

245. E. Suhir, “Interfacial Stresses in Bi-Metal Thermostats”, ASME J. Appl. Mech., vol. 56, No. 3, September 1989

246. E. Suhir, “Analytical Modeling in Structural Analysis for Electronic Packaging: Its Merits, Shortcomings and Interaction with Experimental and Numerical Techniques”, ASME J. Electr. Packaging (JEP), vol. 111, No. 2, June 1989

247. E. Suhir, “Axisymmetric Elastic Deformations of a Finite Circular Cylinder with Application to Low Temperature Strains and Stresses in Solder Joints”, ASME J. Appl. Mech., vol. 56, No. 2, 1989

248. E. Suhir, “Applications of an Epoxy Cap in a Flip-Chip Package Design”, ASME J. Electr. Packaging (JEP), vol. 111, No. 1, 1989

249. E. Suhir, “Bending Performance of Clamped Optical Fibers: Stresses Due to the End Off-Set”, Applied Optics, vol. 28, No. 3, February 1989.

250. E. Suhir, “Can Power Cycling Life of Solder Joint Interconnections Be Assessed on the Basis of Temperature Cycling Tests?”, ASME J. Electr. Packaging (JEP),  vol. 111, No. 4, Dec. 1989.

251. E. Suhir, “Calculated Interfacial Stresses in Elongated Bi-Material Plates Subjected to Bending”, ASME J. Electr. Packaging (JEP),  vol. 111, No. 4, Dec. 1989.

252. E. Suhir, “Twist-off Testing of Solder Joint Interconnections”, ASME J. Electr. Packaging (JEP), vol. 111, No. 3, Sept. 1989.

1988

253. E. Suhir, “Stresses in Dual - Coated Optical Fibers”, ASME J. Appl. Mech., vol. 55, No. 10, 1988.

254. E. Suhir, “Spring Constant In the Buckling of Dual-Coated Optical Fibers”, IEEE/OSA J. Lightwave Technology., vol. 6, No. 7, 1988.

255. E. Suhir, “Effect of Initial Curvature on Low Temperature Microbending in Optical Fibers”, IEEE/OSA J. Lightwave Techn., vol. 6, No. 8, 1988.

256. E. Suhir, “An Approximate Analysis of Stresses in Multilayer Elastic Thin Films”, ASME J. Appl. Mech., vol. 55, No. 3, 1988.

257. E. Suhir, “On a Paradoxical Phenomenon Related to Beams on Elastic Foundation”, ASME J. Appl. Mech., vol. 55, No. 10, 1988.

1986

258. E. Suhir, “Stresses in Bi-Metal Thermostats”, ASME J. Appl. Mech., vol. 53, No. 3, Sept. 1986.

259. S. Luryi and E. Suhir, “A New Approach to the High-Quality Epitaxial Growth of Lattice - Mismatched Materials”, Applied Physics Letters, vol. 49, No. 3, July 1986.

1982

260. E. Suhir, “Shock-Excited Vibrations with Application to the Slamming Response of a Flexible Ship to a Regular Wave Packet”, SNAME J. Ship Research, vol. 26, No. 4, 1982.

1979

261. E. Suhir and V. Lapenas, “The Solution to the Brachistochrona Problem with Consideration of Friction”, Trans. of the National Res. Inst. of Engine Building, Kiev, Ukraine, 1979 (in Russian)

262. E. Suhir and V. Sapkauskas, “Optimal Design of Some Basic Structures Used in Feed-Stuff Machinery”, Trans. of the National Res. Inst. of Engine Building, Kiev, Ukraine, 1979 (in Russian).

1978

263. E. Suhir, “Bending Moments Due to Ship Whipping”, Transactions of the Central Res. Institute of Merchant Marine, No. 233, Leningrad, Russia, 1978 (in Russian).

264. E. Suhir, “Response Functions for Heaving, Pitching and Wave-Induced Bending Moments, with Consideration of the Hull Flexibility”,“Seaworthiness of Ships,” Collected Articles, The USSR Register of Shipping, Leningrad, Russia, 1978 (in Russian).

265. E. Suhir, “Vibration of Rectangular Plates Due to Random Shock Excitation”, “Spatial Structures”, Collected Articles, No. 11, Krasnoyarsk, Russia, 1978 (in Russian).

1977

266. E. Suhir and V. Sapkauskas, “Probabilistic Characteristics of the Reliability of Some Major Feed-Stuff Machinery Structures”, Trans. of the National Res. Inst. of Engine Building, Kiev, Ukraine, 1977 (in Russian)

267. E. Suhir, “Application of the Theory-of-Elasticity Methods for the Evaluation of Forces  Acting in the Channels of Granulating Machines”, Trans. of the National Res. Inst. of Engine Building, Kiev, Ukraine, 1977 (in Russian)

268. E. Suhir, “Nonlinear Vibrations of Plates Due to Shock Loads”, “Spatial Structures”, Collected Articles, No. 10, Krasnoyarsk, Russia, 1977 (in Russian)

1976

269. E. Suhir, “Wave Induced Motion and  Bending Moments For Flexible Ship Hulls”, Transactions of the Central Research Institute of Merchant Marine, No. 223, Leningrad, Russia, 1976 (in Russian).

1973

270. E. Suhir, “Standardized Hydrodynamic Loads Acting on the Freight Containers, Located on the Upper Deck", “Naval Architecture and Off-Shore Structures”, Collected Articles, No. 19, Kharkov University, Kharkov, Ukraine, 1973 (in Russian).

1972

271. E. Suhir, “Nonlinear Vibration of Rectangular and Circular Plates Under Impact Loads”, Transactions of the Institute of Naval Architecture, No. 46, Nikolaev, Ukraine, 1972 (in Russian)

272. E. Suhir, “Exact Solution to the Problem of Steady - State Vibrations of a Nonlinear Oscillator Subjected to Periodic Instantaneous Impulses”, “Naval Architecture and Ship Repair”, Collected Articles, No. 4, Institute of Maritime Engineers, Odessa, Ukraine, 1972 (in Russian).

273. E. Suhir, “Vibration of a Rectangular Plate Subjected to Lateral Periodic Impact Loads and Reactive Membrane Forces”, Transactions of the Institute of Naval Architecture, No.41, Nikolaev, Ukraine,  1972.(in Russian)

274. E. Suhir, “Evaluation of Wave Loads Acting on a Ship Side in Irregular Waves”, Transactions of the Institute of Naval Architecture, No. 41, Nikolaev, Ukraine, 1972 (in Russian).

275. E. Suhir, “Computerized Calculations of Motions and Bending Moments For a Ship in Nonlinear Heave and Pitch”, Transaction of the Institute of  Naval Architecture, Nikolaev, Ukraine, 1972 (in Russian).

276. E. Suhir, “Effect of Ship's Draft and Trim on Her Motions in Heave and Pitch”, “Naval Architecture and Off-Shore Structures”, Collected Articles, No. 9, Kharkov University, Kharkov, Ukraine, 1972 (in Russian).

277. E. Suhir, “Response of Partially Submerged Marine Propellers to Impact Hydrodynamic Loads”, “Naval Architecture and Off-Shore Structures”, Collected Articles, No. 9, Kharkov University, Kharkov, Ukraine, 1972 (in Russian).

278. E. Suhir, “About the Standardized Loading for Containers Carried on the Upper Deck”, Naval Architecture and Off-Shore Structures, Collected articles, X,  Kharkov State University, Issue 19, 1972 (in Russian)

1970

279. Y. Guliev, Y. Vorobyov, E. Suhir and Y. Elis, “Interaction Between Ship Models Passing Each Other In a Narrow Fairway”, “Naval Architecture and Ship Repair”, Collected Articles, No. 1, Institute of Maritime Engineers, Odessa, Ukraine, 1970 (in Russian).

280. E. Suhir, “Differential Equations of Motion For a Ship in Regular Head Waves”, “Theoretical and Practical Problems of Ship Seaworthiness”, Collected Articles, The USSR Register of Shipping, Leningrad, Russia, 1970 (in Russian).

281. E. Suhir, “Evaluation of the Hydrodynamic Load Acting on a Rapidly Immersing Body”, “Naval Architecture and Off-Shore Structures”, Collected Articles, No. 2, Kharkov University, Kharkov, Ukraine, 1970 (in Russian).

282. E. Suhir, “The Equations of Motion of a Body of Variable Form in Liquid, and Their Application to the Problem of Nonlinear Heaving and Pitching of Ships”, Naval Architecture and Off-Shore Structures”, Collected Articles, No. 2, Kharkov University, Kharkov, Ukraine, 1970 (in Russian).

1966

283. E. Suhir, “About the Hydrodynamic Loading on a Body During Its Rapid Immersion into Water”, Naval Architecture and Off-Shore Structures”, Collected articles, Kharkov State University, 1966 (in Russian)

284. E.Suhir, “Ship motion and bending in slamming condition”, “Strength of Ship Structures”, Collected Articles, Society of Naval Architects, issue 85, 1966  (in Russian)

285.  E.Suhir “Equations of Motion of a body of a Variable Shape in Liquid, With Application to the Ship Motion in Heave and Pitch"-X: Kharkov State University, issue 2, 1966 (in Russian)

 

Peer Reviewed Conference Presentations

2017

286. E. Suhir, S. Yi, “Elastic Stability of a Dual-Coated Fiber-Optic Connector”, 2017 SPIE Photonics West, Feb.1,San Francisco, published in the SPIE Digital Library as part of the proceedings of the Silicon Photonics XII conference.

287. E. Suhir, S. Yi, ”Thermal Stress in an Optical Silica Fiber Embedded (Soldered) into Silicon”,  2017 SPIE Photonics West, Jan. 31, San Francisco, published in the SPIE Digital Library as part of the proceedings of the Silicon Photonics XII conference.

288. E. Suhir, S. Yi, “Predicted Lattice-Misfit Stresses in a Gallium-Nitride (GaN) Film”,   2017 SPIE Photonics West, Jan.30, San Francisco, published in the SPIE Digital Library as part of the proceedings of the Silicon Photonics XII conference.

289. E. Suhir, S. Yi, J. Nicolics, L. Bechou, W.Benhadjala, “How Swiftly Should Be a Product Repaired, so that Its Availability is not Compromised?”, EuroSimE, 2017, Dresden, Germany, submitted

290. E.Suhir, S.Yi, “Double Exponential Probability Distribution Function (DEPDF) and Its Applications to Human-in-the-Loop (HITL) Aerospace Problems: When Human Performance Is Imperative, Ability to Quantify It is a Must”, Special NDA Session at the AIAA SciTech Conf., Jan. 9-13, 2017, Gaylord Texan Resort & Convention Center,

291. E.Suhir, S.Yi, “Design-for-Reliability and Accelerated Testing of Aerospace Electronics: What Should Be Done Differently”, Special NDA Session at the AIAA SciTech Conf., Jan. 9-13, 2017, Gaylord Texan Resort & Convention Center, submitted

292. E.Suhir, S.Yi, J.Nicolics, “Statistics- and Reliability Physics Related Failure Rates”,  IRPS, Monterey, April 2-6, 2017, submitted

293. E.Suhir, S.Yi, J.Nicolics, “When Equipment Reliability and Human Performance Contribute Jointly to Vehicular Mission Success and Safety, Ability to Quantify Its Outcome is a Imperative”,   IRPS, Monterey, April 2-6, 2017, submitted

2016

294. E. Suhir, S. Yi, “Predicted Thermal Stresses in a TSV Design”, San-Francisco, CA, Nov.8-10, 2016

295. E.Suhir, S.Yi, “Probabilistic Design for Reliability of Medical Electronic Devices: Role, Significance, Attributes, Challenges”, IEEE Medical Electronics Symp., Portland, OR, Sept. 14-15, 2016

296. E. Suhir, L. Bechou, R. Ghaffarian, J. Nicolics, “Column-Grid-Array (CGA) Technology Could Lead to a Highly Reliable Package Design”, IEEE Aerospace Conference, Big Sky, Montana, March 5-12, 2016

297. E.Suhir, J.Nicolics, and S. Yi, "Probabilistic Predictive Modeling (PPM) of Aerospace Electronics (AE) Reliability: Prognostic-and-Health-Monitoring (PHM) Effort Using Bayes Formula (BF), Boltzmann-Arrhenius-Zhurkov (BAZ) Equation and Beta-Distribution (BD)", 2016 EuroSimE Conf., Montpelier, France, 2016

298. E. Suhir, M. Unger, L. Cvitkovich, and J. Nicolics, “Power Core Embedding a Plurality of IC Devices and Sandwiched Between Two Insulated Metal Substrates: Predicted Thermal Stresses”, 2016 EuroSimE Conf., Montpelier, France, 2016

299. E.Suhir, J.Nicolics, “Aerospace Electronics-and-Photonics (AEP) Reliability Has to be Quantified to be Assured”, AIAA SciTech Conf., San Diego, CA, January 2016

2015

300. E. Suhir, A. Bensoussan, J. Nicolics, “Bow-Free Pre-Stressed ALT Specimen”, SAE Conf., Seattle, WA, Sept. 22-24, 2015

301. E. Suhir, "Analytical Modeling Enables One to Explain Paradoxical Situations in the Behavior and Performance of Electronic Materials and Products" (keynote presentation), Int. Conf. on Materials, Processing and Products Engineering (MPPE), Leoben, Austria, Nov. 3-5, 2015

302. E. Suhir, G. Khatibi, J. Nicolics, M. Lederer, "Semiconductor Film Grown on a Circular Substrate: Predictive Modeling of the Lattice-Misfit Stresses”, Ibid.

303. A. Bensoussanm E. Suhir, P. Henderson, M. Zahir, “A Unified Multiple Stress Reliability Model for Microelectronic Devices: Application to 1.55 DFB Laser Diode Module for Space Validation”, ESREF, Toulouse, France, Oct. 2015

304. E. Suhir, A. Bensoussan, “Degradation Related Failure Rate Determined from the Experimental Bathtub Curve”, SAE Conf., Seattle, WA, Sept. 22-24,.2015

305. E. Suhir, “Human-in-the-Loop and Aerospace Navigation Success and Safety: Application of Probabilistic Predictive Modeling”, SAE Conf., Seattle, WA, Sept. 22-24, .2015

306. E. Suhir, “Failure Oriented Accelerated Testing (FOAT), and Its Role in Making a Viable VLSI Device into a Reliable Product, 2015 IEEE VLSI Test Symp. Silverado Resort and Spa, Napa, CA, April 27-29, 2015

307. E. Suhir, A. Bensoussan, G. Khatibi, J. Nicolics, “Probabilistic Design for Reliability in Electronics and Photonics: Role, Significance, Attributes, Challenges”, IRPS, Hyatt Regency Monterey Resort & Spa, Monterey, CA, USA, April 19-23, 2015

308. E. Suhir,  “Analytical Stress Modeling for TSVs in 3D Packaging”, Semi-Term, San-Jose, March 15-19, 2015

309. E. Suhir, L. Bechou, “Thermal Stress in an Electronic Package Sandwiched Between Two Identical Substrates”,  IEEE Aerospace Conference, Big Sky, Montana, March 5-12,  2015E

310. E. Suhir, “Assessment of Product’s Degradation Rate from the Measured Bathtub Curve Data”, 2015 IEEE Aerospace Conference, Big Sky, Montana, March 5-12, 2015

311. E. Suhir, “Analytical Predictive Modeling in Fiber Optics Structural Analysis: Review and Extension”, SPIE, San-Francisco, February 10, 2015

312. E. Suhir, “Stress Related Aspects of the Physics of GaN Material Growth”, SPIE, San-Francisco, February 10, 2015

2014

313. E.Suhir,” Reliability Physics and Probabilistic Design for Reliability (PDfR): Role, Attributes, Challenges”  EPTC 2014, Singapore, November 5th, 2014 (invited)

314. G. Khatibi, B.Czerny, J.Magnien, M.Lederer, E.Suhir, J. Nicolics, “Towards Adequate Qualification Testing of Electronic Products: Review and Extension”, EPTC 2014, Singapore, November 5th, 2014 (invited)

315. E. Suhir, A. Bensoussan, “Quantified Reliability of Aerospace  Optoelectronics”, SAE Aerospace Systems and Technology Conference, September 23-25 2014 — Cincinnati, OH, USA

316. Z. Remili, Y. Ousten, B. Levrier, D. Mercier, E. Suhir, L. Bechou, “Thermo-mechanical Stress Analysis of Copper/Silicon Interface in Through Silicon Vias using FEM simulations and experimental analysis”, IEEE CPMT ESTC Conference, Helsinki, 2014

317.  V. Murashev, S. Legotin, K. Tapero, E.Suhir,  “Asynchronous Scanning Photo-receiver Based on Injection-Coupled Device”, 2014 ISROS Conference, June 2014

318. J.-M. Salotti, R. Hedmann, E.Suhir, “ Crew Size Impact on the Design, Risks and Cost of a Human Mission to Mars”, 2014 IEEE Aerospace Conference, Big Sky, Montana, March 2014

319. E.Suhir, A. Bensoussan, L. Bechou, “Aerospace Electronic Packaging: Thermal Stress in Bi- and Tri-Material Assemblies”, 2014 IEEE Aerospace Conference, Big Sky, Montana, March 2014

320. E.Suhir, A.Bensoussan, “Application of Multi-parametric BAZ Model in Aerospace Optoelectronics”, 2014 IEEE Aerospace Conference, Big Sky, Montana, March 2014

321. E. Suhir, A.Bensoussan, J.Nicolics, L.Bechou, “Highly Accelerated Life Testing (HALT), Failure Oriented Accelerated Testing (FOAT), and Their Role in Making a Viable Device into a Reliable Product”, 2014 IEEE Aerospace Conference, Big Sky, Montana, March 2014

322. J.-M. Salotti, E. Suhir, “Some Major Guiding Principles for Making  Future Manned Missions to Mars Safe and Reliable”, 2014 IEEE Aerospace Conference, Big Sky, Montana, March 2014

323. V. N. Murashev, P.A. Ivshin, S.A.Legotin, K. Tapero, E. Suhir, “Injection-coupled Devices (ICDs): Operation Principle, Applications, Design-for-Reliability”,  2014 IEEE Aerospace Conference, Big Sky, Montana, March 2014

324. D. Gucik-Derigny, A. Zolghadri. L. Bechou, E. Suhir, “Prediction of Remaining Useful Life (RUL) of Ball-Grid-Array (BGA) Interconnections During Testing on the Board Level”, 2014 IEEE Aerospace Conference, Big Sky, Montana, March 2014

325. E. Suhir, “Failure-Oriented-Accelerated-Testing (FOAT) and Its Role in Making a Viable Package into a Reliable Product”, SEMI-TERM 2014, San Jose, CA, March 9-13, 2014

326. D. Gucik-Derigny, A. Zolghadri, E. Suhir, L. Bechou, "A Model-Based Prognosis Strategy for Prediction of Remaining Useful Life of Ball-Grid-Array Interconnections", 19th World Congress of the International Federation of Automatic Control,  Cape Town, South Africa, August 24-29, 2014

2013

327. E. Suhir, L. Bechou,  “Saint-Venant’s Principle and the Minimum Length of a Dual-Coated Optical Fiber Specimen in Reliability (Proof) Testing”, ESREF, Arcachon, France, 2013 

328. E. Suhir, L. Bechou, A.Bensoussan, J. Nicolics “Photovoltaic Reliability Engineering: Qualification Testing (QT) and Probabilistic Design-for-Reliability (PDfR) Concept”,  invited presentation, 2013 SPIE PV Reliability Conference, San Diego CA, August 2013

329. W. Benhadjala, I. Bord-Majek, L. Béchou, E. Suhir, M. Buet, F. Rougé, V. Gaud. and Y. Ousten, “Effect of Processing Factors on Dielectric Properties  of BaTiO3/Hyperbranched Polyester Core-Shell Nano-Particles”, ECTC,  San Diego, May 2013

330. A. Bensoussan and E. Suhir, “Design-for-Reliability (DfR) of Aerospace Electronics: Attributes and Challenges",  2013 IEEE Aerospace Conference, Big Sky, Montana, March 2013

331. E. Suhir, “Assuring Aerospace Electronics and Photonics Reliability: What Could and Should Be Done Differently”, 2013 IEEE Aerospace Conference, Big Sky, Montana, March 2013

332. E. Suhir, “Predicted Reliability of Aerospace Electronics: Application of Two Advanced Probabilistic Techniques”, 2013 IEEE Aerospace Conference, Big Sky, Montana, March 2013

333. E. Suhir, L .Bechou, B. Levrier, D. Calvez, “Assessment of the Size of the Inelastic Zone in a BGA Assembly”, 2013 IEEE Aerospace Conference, Big Sky, Montana, March 2013

334. E. Suhir, “Elastic Stability of a Dual-Coated Fiber”, SPIE Paper #8621-37, Photonics West, February 2013

2012

335. E.Suhir, “Thermal Stress in Electronics and Photonics: Prediction and Prevention”, Keynote presentation, Therminic, Budapest, September 2012

336. E.Suhir, “Dynamic Response of Electronic Systems to Shocks and Vibrations: Application of Analytical (Mathematical) Modeling”, 2012 DYMAT Conference

337. E. Suhir, R. Mahajan, A. Lucero, L. Bechou, “Probabilistic Design for Reliability (PDfR) and a Novel Approach to Qualification Testing (QT)”, 2012 IEEE/AIAA Aerospace Conf., Big Sky, Montana, 2012

338. B. Nagl, E.Suhir, W. Gschohsmann, J.Nicolics, “Transient Thermo-Mechanical Study of a Thick-Wire Bond with Particular Attention to the Interfacial Shearing Stress”,  Int. Spring Seminar on Electronics Technology (ISSE), 09-13, Bad Aussee, Austria, May 2012

339. W. Benhadjala, I. Bord,  L. Béchou, E. Suhir,  M. Buet, F. Rougé,  Y. Ousten,  “Novel Core-Shell Nanocomposite for RF Embedded Capacitors:  Processing and Characterization”,  2012 ECTC , June 2012

2011

340. E.Suhir, "Human-in-the-Loop”: Likelihood of a Vehicular Mission-Success-and-Safety, and the Role of the Human Factor”, Paper ID 1168, 2011 IEEE/AIAA Aerospace Conference, Big Sky, Montana, March 5-12, 2011

2009

341. E. Suhir, “Stretchable Electronics: Does One Need a Good Thermal Expansion Match Between the Si Die and the Plastic Carrier?” , IEEE ECTC 2009

342. T. Reinikainen and E.Suhir, “Novel Shear Test Methodology for the Most Accurate Assessment of Solder Material Properties”, IEEE ECTC 2009

343. E. Suhir, “Lateral Compliance and Elastic Stability of a Dual-Coated Optical Fiber of Finite Length, with Application to Nano-Rods Embedded in Low-Modulus Elastic Media”, IEEE ECTC 2009 

344. E.Suhir, “Helicopter-Landing-Ship: Undercarriage Strength and the Role of the Human Factor”, ASME OMAE Conference, June 1-9, Honolulu, Hawaii, 2009;

2008

345. E. Suhir and S. Savastiuk, “Disc-like Copper Vias Fabricated in a Silicon Wafer:  Design for Reliability”,  58-th IEEE ECTC 2008

2007

346. E. Suhir, “Dynamic Response of Micro-Electronic Structural Elements to Shocks and Vibrations”, Keynote presentation, MicroNanoReliability Congress, Berlin-Koepenick, September 2-5, 2007

347. E. Suhir, “Polymer Coating of Optical Silica Fibers, and a Nanomaterial-Based Coating System”, Keynote Presentation,  Polytronic’2007, Proceedings of the International Conference on Polymeric Materials for Micro- and Opto-Electronics Applications, Tokyo, Japan, January 14-16, 2007

2006

348. Yi. Zhang, Yuan Xu, Claire Gu and Ephraim Suhir, “Predicted Shear-off Stress in Bonded Assemblies: Review and Extension” ASTR 2006, San Francisco, CA, 2006

349. E. Suhir, “Fiber Optics Structural Mechanics, and a New Generation of Nano-Technology Based Optical Fiber Cladding and Coating”, Invited talk at the Photonics West Conf., and SPIE Publication, 2006

350. E. Suhir, D. Ingman, “Highly Compliant Bonding Material and Structure for Micro- and Opto-Electronic Applications”, ECTC’06 Proceedings, San Diego, May 2006

2005

351. E. Suhir, “Analytical Thermal Stress Modeling in Physical Design for Reliability of Micro- and Opto-Electronic Systems: Role, Attributes, Challenges, Results”, Invited Talk, Therminic, 2005, Lago Maggiore, Italy, September 27-30, 2005

352. E. Suhir, “Mechanics of Coated Optical Fibers: Review and Extension”, ECTC’2005, Orlando, Florida, 2005

353. E. Suhir, “Microelectronic and Photonic Systems: Role of Structural Analysis”, InterPack’2005 Conference, San Francisco, July 2005

354. E. Suhir, “New Nano-Particle Material (NPM) for Micro- and Opto-Electronic Packaging Applications”, IEEE Workshop on Advanced Packaging Materials, Irvine, March 2005.

2004

355. E. Suhir, “Bow-Free Assemblies: Predicted Stresses”, Therminic’2004, Niece, France, Sept. 29-Oct.1, 2004

356. E. Suhir, “Polymer Coated Optical Glass Fiber Reliability: Could Nano-Technology Make a Difference?”, Polytronic’04, Portland, OR, September 13-15, 2004

2003

357. E. Suhir, “Thermal Stress Modeling in Micro- and Opto-Electronics: Review and Extension”, Invited Presentation, ASME Symposium Dedicated to Dr. Richard Chu, IBM, Washington, DC, November 2003

358. E. Suhir, “Polymer Coated Optical Glass Fibers: Review and Extension”, Proceedings of the POLYTRONIK’2003, Montreaux, October 21-24, 2003.

359. E. Suhir, V.Ogenko, D. Ingman, “Two-Point Bending of Coated Optical Fibers”, Proceedings of the PhoMat’2003 Conference, San-Francisco, CA, August 2003

360. E. Suhir, “How to Make a Photonic Device Into a Product: Role of Accelerated Life Testing”, Keynote Address at the International Conference of Business Aspects of Microelectronic Industry, Hong-Kong, January 2003.

2002

361. E.Suhir, “Could Shock Tests Adequately Mimic Drop Test Conditions?”, IEEE ECTC Conference Proceedings, San-Diego, CA, May 28-31, 2002

2001

362. E. Suhir, “Adequate Underkeel Clearance (UKC) for a Ship Passing a Shallow Waterway: Application of the Extreme Value Distribution (EVD)”, Proceedings of OMAE2001 Conference, Paper OMAE2001/S&R-2113, Rio de Janeiro, Brazil, 2001

2000

363. A. Katz, M. Pecht, E. Suhir, “Accelerated Testing in Microelectronics: Review, Pitfalls and New Developments”, Proceedings of the International Symposium on Microelectronics and Packaging, IMAPS, Israel, 2000

364. E.Suhir, “The Future of Microelectronics and Photonics, and the Role of Mechanical, Materials and Reliability Engineering”, Proceedings of the International Conference on Materials in Microelectronics, MicroMat 2000, April 17-19, 2000, Berlin, Germany

365. E.Suhir, “Silica Optical Fiber Interconnects: Design for Reliability”, Proceedings of the Annual Conference of the American Ceramic Society, St.-Louis, MO, May 3, 2000

1999

366. E.Suhir, “Elastic Stability of the Glass Fibers in a Micromachined Fiber-Optic Switch Packaged into a Dual-in-Line Ceramic Package”, ECTC, 1999

1998

367. E. Suhir, “Coated Optical Fiber Interconnect Subjected to the Ends Off-Set and Axial Loading”, International Workshop on Reliability of Polymeric Materials and Plastic Packages of IC Devices, Paris, Nov. 29- Dec.2, 1998, ASME Press, 1998.

368. E. Suhir, “Critical Strain and Postbuckling Stress in Polymer Coated Optical Fiber Interconnect: What Could Be Gained by Using Thicker Coating?”, International Workshop on Reliability of Polymeric Materials and Plastic Packages of IC Devices, Paris, Nov. 29- Dec.2, 1998, ASME Press, 1998.

369. E. Suhir, “Bending Stress in an Optical Fiber Interconnect Experiencing Significant Ends Off-Set”, MRS Symp. Proc., vol. 531, 1998.

370. E. Suhir, “Optical Fiber Interconnect Subjected to a Not-Very-Small Ends Off-Set: Effect of the Reactive Tension”, MRS Symposia Proceedings, vol. 531, 1998.

371. E. Suhir, “’Optical Glass Fiber Bent on a Cylindrical Surface”, MRS Symposia Proceedings, vol.531, 1998.

1997

372. E. Suhir, “Dynamic Response of Microelectronics and Photonics Systems to Shocks and Vibrations”, Proceedings of the International Conference on Microelectronics and Photonics Packaging, INTERPack’97, Hawaii, June 15-19, 1997.

373. E. Suhir, “Effect of Plastic Package Geometry on Its Propensity to Moisture Induced Failure”, IMAPS/NATO Workshop Proceedings, Bled, Slovenia, 1997

374. E. Suhir, “The Future of Microelectronics and Photonics and the Role of Mechanics and Materials”, Proceedings of the Electronic Packaging and Technology Conf., EPTC’97, Singapore, October 1997.

375. E. Suhir, "Bending of a Partially Coated Glass Fiber Subjected to the Ends Off-Set", Proc. of the 47-th Electr. Comp. and Techn. Conference, IEEE, San Jose, CA, May 1997, see also IEEE CPMT Transactions, June 1997.

376. E. Suhir, “Solder Materials and Joints in Fiber Optics: Reliability Requirements and Predicted Stresses”, Proc. of the Int. Symp. on “Design and Reliability of Solders and Solder Interconnections”, Orlando, Fl., Febr. 1997.

377. M. Uschitsky and E. Suhir, “Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles”, in E. Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, ASME Press, 1997.

1996

378. B. Welker, M. Uschitsky, E. Suhir, S. Kher, G. Bubel, “Finite Element Analysis of the Optical Fiber Structures”, in E. Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, Symposium Proceedings, ASME Press, 1996

379. E. Suhir, “Flex Circuit  vs  Regular” Substrate: Predicted Reduction in the Shearing Stress in Solder Joints”, Proc. of the 3-rd Int. Conf. on Flexible Circuits FLEXCON 96, San-Jose, CA, Oct. 1996.

380. M. Uschitsky, E. Suhir, L. Shepherd, W.R. Lambert, and M.A. Zimmerman, “Predicted Dynamic Strength and Durability of a Network Interface Unit (NIU) Enclosure”, in E. Suhir, ed., Structural Analysis in Microelectronics and Fiber Optics”, Symposium Proceedings, ASME Press, 1996.

381. E. Suhir, and Q.S.M. Ilyas, ““Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: How Different is Their Propensity to Moisture Induced Failures?”, in E. Suhir, ed., “Structural Analysis in Micro-electronics and Fiber Optics”, Symposium Proceedings, ASME Press, 1996.

382. M. Uschitsky, E. Suhir, “Predicted Thermally Induced Stresses in an Epoxy Molding Compound at the Chip Corner”, in E. Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, Symposium Proceedings, ASME Press, 1996.

1995

383. M. Uschitsky, E. Suhir, S. Kher, and G. Bubel, “Epoxy Bonded Optical Fibers: the Effect of Voids on Stress Concentration in the Epoxy Material”, in E. Suhir, ed., “Structural Analysis in Microelectronic and Fiber Optic Systems”, Symposium Proceedings, ASME Press, 1995.

384. E. Suhir, “Predicted Failure Criterion (von-Mises Stress) in Plastic Packages During High Temperature Reflow Soldering”, 45-th ECTC Proceedings, Las Vegas, May 1995.

385. E. Suhir, V. Mishkevich, and J. Anderson, “How Large Should a Periodic External Load Be to Cause Appreciable Microbending Losses in a Dual-Coated Optical Fiber?”, in E. Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, Symposium Proceedings, ASME Press, 1995.

386. E. Suhir, “Global” and “Local” Thermal Mismatch Stresses in an Elongated Bi-Material Assembly Bonded at the Ends”, in E. Suhir, ed., “Structural Analysis in Microelectronic and Fiber-Optic Systems”, Symposium Proceedings, ASME Press, 1995.

1993

387. E. Suhir, “Mechanical Reliability of Flip-Chip Interconnections in Silicon-on-Silicon Multichip Modules”, IEEE Conference on Multichip Modules, IEEE, Santa Cruz, Calif., March 1993.

388. E. Suhir, “Predicted Interfacial Shearing Stress in Dual-Coated Optical Fiber Specimens Subjected to Tension”, Part 2, “The Case of a Specimen Embedded into Epoxy”, ANTEC-93,  May 1993, SPE, New Orleans, Louisiana.

389. E. Suhir, “Predicted Interfacial Shearing Stress in Dual-Coated Optical Fiber Specimens Subjected to Tension”, Part 1, “The Case of a Cylindrical Double Lap Shear Joint”, ANTEC-93, May 1993, SPE, New Orleans, Louisiana.

1992

390. E. Suhir and T. M. Sullivan, “Novel Technique for the Evaluation of the Adhesive Strength of the Epoxy Molding Compounds Used in Plastic Packaging”, 42-nd Electr. Comp. and Techn. Conf., IEEE, San-Diego, Calif., May 1992.

391. E. Suhir, “Mechanical Behavior and Reliability of Solder Joint Interconnections in Thermally Matched Assemblies”,  42-nd Electr. Comp. and Techn. Conf., IEEE, San-Diego, Calif., May 1992.

392. E. Suhir, “Predicted Bow of Plastic Packages of Integrated Circuit (IC) Devices”, 50-th SPE Conf., SPE, Detroit, MI, May 1992. 

1991

393. E. Suhir, “Nonlinear Dynamic Response of a Flexible Printed Circuit Board to Shock Loads Applied to Its Support Contour”,  41-st Elect. Comp. and Techn. Conf., IEEE, Atlanta, Georgia, May 1991.

394. E. Suhir, “Mechanical Behavior of Materials in Microelectronic and Fiber Optic Systems: Application of Analytical Modeling-Review”, MRS Symposia Proc., vol. 226, 1991.

1990

395. E. Suhir and B. Poborets, “Solder Glass Attachment in Cerdip/Cerquad Packages: Thermally Induced Stresses and Mechanical Reliability”, 40th Elect. Comp. and Techn. Conf., Las Vegas, Nevada, May 1990;

1989

396. E. Suhir, “Calculated Stresses in Microelectronic and Fiber-Optic Structures”, Proc. of the 1st Pan American Congress of Applied Mechanics, American Academy of Mechanics, Rio de Janeiro, Brazil, January 1989.

397. E. Suhir, “Mechanical Behavior of Materials in Microelectronic and Fiber-Optic Systems: Application of Analytical Modeling-Review”, ASME 89-WA/EEP-16, 1989 Winter Annual Meeting, San-Francisco, December 1989.

398. E. Suhir, “Thermally Induced Stresses in Elongated Bi-Material Plates”, Applied Mechanics Reviews, 1989 Supplement, “Mechanics Pan America 1989, Selected and Revised Proceedings of the January 1989 Rio de Janeiro Pan American Congress of Applied Mechanics,  C. R. Steele, A. W. Leissa and M. R. M. Crespo de Silva, eds., vol. 42, No. 11, part 2, Nov. 1989.

1988

399. E. Suhir and J. M. Segelken, "Mechanical Behavior of Flip-Chip Encapsulants”, Semicon/East Technical Proc., Semiconductor Equipment and Materials International, Boston, Mass., Sept. 1988.

400. E. Suhir, “Could Compliant External Leads Reduce the Strength of a Surface Mounted Device?”, Proc. of the 38th Electr. Comp. Conf., IEEE, Los Angeles, Calif., May 1988.

401. E. Suhir, “Calculated Stresses in Dual-Coated Fibers”, Proc. of the SPE 46th Annual Technical Conference, ANTEC '88, Atlanta, Georgia, May 1988.

1987

402. E. Suhir, “Die Attachment Design and Its Influence on the Thermally Induced Stresses in the Die and the Attachment”, Proc. of the 37th Elect. Comp. Conf., IEEE, Boston, Mass., May 1987.

403. E. Suhir and W. E. Benedetto, “Mechanical Behavior of the “Euler” Test Probe”, Preprint ASME 87-WA/EEP-5, 1987 Winter Annual Meeting, Boston, Mass., Dec. 1987. 

1986

404. E. Suhir, “Calculated Thermally Induced Stresses in Adhesively Bonded and Soldered Assemblies”,  Proc. of the Int. Symp. on Microelectronics, ISHM, 1986, Atlanta, Georgia, Oct. 1986.

405. E. Suhir, “Stresses in Adhesively Bonded Bi-material Assemblies used in Electronic Packaging,” Proceedings of the Electronic Packaging Materials Science Symposium II, Palo Alto, California, April 15-18, pp.133-138, 1986.

1985

406. E. Suhir, “Linear and Nonlinear Vibrations Caused by Periodic Impulses”, AIAA/ASME/ASCE/AHS 26th Structures, Structural Dynamics and Materials Conference, Orlando, Florida, April 1985.

1979

407. E. Suhir, “Probability Distributions of Stresses Due to the Combined Action of Wave-Induced and Wave-Excited Hull Vibration Bending Moments”, Proc. of the National Conference on Strength and Vibration of Ship Structures, Research Soc. for Shipbuilding Industry, Leningrad, Russia, 1979 (in Russian)

1978

408. E. Suhir, “Ship Slamming in Regular Seas”, Proc. of the National Conference on Ship Structural Damage and Reliability, Far East Polytechnic Institute, Vladivostok, Russia, 1978 (in Russian)

1976

409. E. Suhir, “Evaluation of the Errors Caused by Substitution of a Short-Term Load by an Instantaneous Impulse for a Nonlinear One-Degree-of-Freedom Vibration System”, Proc. of the National Conference on Strength and Vibration of Ocean Structures, Research Society for Shipbuilding Industry, Leningrad, Russia, 1976 (in Russian)

1975

410. E. Suhir, “Stochastically Unstable Nonlinear Vibrations of  Rectangular Plates Due to Periodic Impacts”, Proc. of the National Conference on the Theory of Shells and Plates, Academies of Sciences of the USSR and the Georgian SSR, Mezniereba, Tbilisi, Georgia, 1975 (in Russian)

411. E. Suhir, “Nonlinear Shock-Excited Vibrations of Rectangular Plates with Consideration of Higher Modes”, Proc. Of the  National Conference on the Damage and Reliability of Ship Structures, Far East Polytechnic Institute, Vladivostok, Russia, 1975 (in Russian)

412. E. Suhir and A. Serdyuchenko, “Longitudinal Distribution of  External Hydrodynamic Loads Causing Wave Excited Hull Vibration”, Proc. of the National Conference on Ship Structural Damage and Reliability, Far East Polytechnic Institute, Vladivostok, Russia, 1975 (in Russian).

413. E. Suhir, “Ship Motion and Wave Bending Moments with Consideration of the Hull Flexibility”, Proc. of the National Conference on Ship Hydrodynamics, Research Society for Shipbuilding Industry, Leningrad, Russia, 1975 (in Russian)

1974

414. E. Suhir, “Stochastic Approach to the Problem of  Nonlinear Vibrations of a One-Degree-of-Freedom System Subjected to Repetitive Impacts”, Proc. of the National Symposium on Nonlinear Mechanical Vibrations, Academies of Sciences of the USSR and the Ukrainian SSR, Naukova Dumka, Kiev, Ukraine, 1974 (in Russian)

1973

415. E. Suhir, V. Suslov and A. Leshchinsky, “Investigation of Stresses in the Deck Plating of a Trawler”, Proc. of the National Conference on Ship Structural Damage and Reliability, Far East Polytechnical Institute, Vladivostok, Russia, 1973 (in Russian).

416. E. Suhir, “Design and Calculation of Knee Joints For Sea-Going Ships”, Proc. of the National Conference on Ship Structural Damage and Reliability, Far East Polytechnic Institute, Vladivostok, Russia, 1973 (in Russian).

417. E. Suhir, “Response Function For Bending Moments Caused by Wave-Excited Hull Vibration”, Proc. of the National Conference on the Strength of Large Sea-Going Ships, Research Society for Shipbuilding Industry, Leningrad, Russia, 1973 (in Russian)

 

Articles in Trade Magazines

418. E. Suhir, “Relieving Stress in Flip-Chip Solder Joints”, Chip Scale Reviews, September-October, 2017

419. E.Suhir, “Avoiding Low-Cycle Fatigue in Solder Material Using Inhomogeneous Column-Grid-Array (CGA) Design”,  ChipScale Reviews, March-April 2016

420. E. Suhir, “Electronics Reliability Cannot Be Assured, if it is not Quantified”, Chip Scale Reviews, March-April, 2014

421. E.Suhir, “Failure-Oriented-Accelerated-Testing (FOAT) and Its Role in Making a Viable IC Package into a Reliable Product”,  Circuits Assembly, July 2013

422. E. Suhir, L. Bechou, “Availability Index and Minimized Reliability Cost”, Circuit Assemblies, February 2013

423. E. Suhir, L. Bechou, A.Bensoussan, “Technical Diagnostics in Electronics: Application of Bayes Formula and Boltzmann-Arrhenius-Zhurkov Model”, Circuit Assembly, December 3,  2012

424. E. Suhir, “Electronic Product Qual Specs Should Consider Its Most Likely Application(s)”, Chip Scale Reviews, November 2012

425. E.Suhir, “Predictive Modeling is a Powerful Means to Prevent Thermal Stress Failures in Electronics and Photonics”, Chip Scale Reviews, vol.15, No.4, July-August 2011

426. E. Suhir, R. Mahajan, “Are Current Qualification Practices Adequate?“, Circuit Assembly, April 2011

427. E. Suhir, “Probabilistic Design for Reliability”, Chip Scale Reviews, vol.14, No.6, 2010

428. E. Suhir, “Reliability and Accelerated Life Testing”, Semiconductor International, February 1, 2005.

429. E.Suhir, “Inventive Leadership: Could a Good Engineer Become a Good Entrepreneur?”, ASME Mechanical Engineering, November 2005

430. E. Suhir, “Crossing the Lines, or Should We Just Mind Our Own Business?”, Feature Article, ASME Mech. Engineering, 2004

431. E.Suhir, “Analytical Stress-Strain Modeling in Photonics Engineering: Its Role, Attributes and Interaction with the Finite-Element Method”, Laser Focus World, May 2002.

432. E. Suhir, “Thermo-Mechanical Stress Modeling in Microelectronics and Photonics”, Electronics Cooling, vol.7, No.4, 2001

433. E. Suhir, “Thermal Stress Failures in Microelectronics and Photonics: Prediction and Prevention”, Future Circuits International, issue 5, 1999

 

 

 

 

 

 

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